Nextreme Expands Engineering Consulting Services to Rapidly Solve Thermal and Power Management Issues
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, has announced the expansion of its services offerings to include materials evaluation and characterization services. Equipped with a full range of thermal modeling, design and engineering consulting services, Nextreme’s team of engineers can accelerate the development of new applications that are currently thermally constrained.
With recent advances in materials sciences and nanotechnology, new materials are being developed that exhibit thermoelectric properties. The assessment of thermoelectric materials is a challenge, particularly when investigating them over significant temperature ranges. Nextreme has capabilities to conduct measurements across a range of temperatures ranging below 200K to above 700K. Properties that can be measured include Seebeck coefficient, electrical resistivity and thermal conductivity.
In addition to the evaluation of materials, Nextreme offers thermal modeling, design and engineering services to deliver fully optimized thermal management solutions. Nextreme routinely conducts analytical and numerical thermal modeling at all design levels from component to module to subsystem. Design services range from rudimentary analysis such as 1-dimensional and 3-D modeling to more complex analyses that may involve the use of passive heat rejection systems, such as heat sinks and exchangers, or the use of active devices such as thermoelectric coolers to solve the overall thermal problem. Advanced analysis of complex systems, components or packages often require more detailed modeling to understand heat flow and thermal gradients.
Nextreme works with the customer to provide design solutions to best fit the customer's needs and budget. The use of Nextreme’s engineering services can enable rapid and successful prototyping and accelerate a program as well as reduce program delays.
"Initial evaluation and integration of micro-scale thermoelectrics is often a challenge for organizations without thermal engineering expertise or when existing resources are limited," said Dave Koester, vice president of engineering at Nextreme. "In all cases, our staff works closely with the customer as a partner to develop optimized solutions that accelerate time-to-market in the most efficient and cost-effective manner possible."
Nextreme uses its breakthrough thin-film thermoelectric technology to produce discrete and integrated cooling and power generation devices. Nextreme currently offers several thermoelectric coolers, such as the OptoCooler HV14 and UPF40, that are capable of cooling and heating in ranges from 0.4 watts to 4 watts, with plans to provide higher heat pumping in the near future. Modules for electronics cooling and power generation are available for order now and pricing is available upon request.
About Nextreme Thermal Solutions™, Inc.:
Nextreme Thermal Solutions offers electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets. The company uses microscale thermoelectric technology and high-volume semiconductor manufacturing processes to address the growing needs for advanced thermal management and clean-energy solutions world-wide. Nextreme also offers sophisticated modeling, design, engineering, and contract manufacturing services to deliver fullyoptimized solutions from standard and customized products that solve the most challenging thermal and power management issues. Nextreme's headquarters and manufacturing facility are based near Research Triangle Park, North Carolina. Visit www.nextreme.com.
