|
LED with light transmissive heat sink |
Osram Sylvania Inc - Danvers, MA, US
Apr 18, 2007
Abstract:
An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.
Background of the invention [The Full Description is not available currently. Check back soon!] Claims[The Full Description is not available currently. Check back soon!] See full document in pdf.
|
