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Home > Business > Events > Event News > Call for Papers: ITherm 2016
News-Spot | Event News | Aug 27, 2015

Call for Papers: ITherm 2016

ITherm 2016, the fifteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems, is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems.

ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016,, a premier electronic packaging conference, at the Cosmopolitan Hotel in Las Vegas, Nevada, USA.  Based on the success of ITherm 2014 in Orlando, Florida, USA, papers will be presented in oral and selected topical poster sessions.  All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings.  In addition to paper presentations and vendor exhibits, ITherm 2016 will include panel discussions, keynote lectures by prominent speakers, and professional short courses.  Original papers are solicited in the following general areas (but not limited to):

Thermal Management:
Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials
Natural and Forced Convection Air Cooling
Advances in Compact Air Movers
Single-Phase Liquid Cooling
Novel Phase Change Cooling Techniques: Boiling, Thin Film Evaporation, Heat Pipes, Thermosyphon, Spray and Jet Impingement
Microfabricated Thermal Management Devices and Systems
Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric
Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.
Thermal and Energy Management in Data Centers
Three-Dimensional Electronics
Advances in Experimental Characterization
Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling, Multi-Objective Design and Optimization


Modeling and Simulation for Reliability at Package, Board, and System Levels
Failure Mechanics and Damage Modeling
Experimental Techniques
Constitutive Models
Impact, Drop and Vibrational Analysis of Packages,
Sub-Systems, and Systems
Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
Materials Characterization, Simulation, Design


Emerging Technologies:
Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures
Chip-Integrated/Embedded Cooling Systems
Fiber-Optics Interconnect Systems & Free Space
Optical Interconnects
MEMS: Device and Package Level Reliability Issues
Integrated Biochips and Bioelectronics
Medical, Telecommunication, and Automotive Systems
Space Systems: Earth Orbiting and Deep-Space Missions


Submit an Abstract
Please submit a 400 word text-only (no figures and tables) abstract on the ITherm website: Deadline for Abstracts is September 4th, 2015. Notifications of acceptance will be sent out by October 2nd, 2015.