Products, Materials & Tools | Aug 28, 2014

New Chip Scale ReadyMount™ EC LED Series from SemiLEDs

SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and mass production availability of its newest line of white chip scale packages, the ReadyMount™ Enhanced CSP, or EC series. By combining SemiLEDs’ Enhanced Flip chip (EF) approach with the company’s innovative ReadyWhite™ phosphor technology, the EC delivers unprecedented flexibility, reliability and manufacturability in a single 1.4 x 1.4mm low profile device. Rated for input power of up to 3W, the EC is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application, lowering capital costs and enabling extremely high lumen density configurations.

Mark Tuttle, General Manager for SemiLEDs Optoelectronics Co., Ltd., commented, “The new ReadyMount white chip scale package is leveraging a powerful synergy within SemiLEDs’ broad technology portfolio to create an entirely new value point in the LED industry. Our unique Chip Scale Package (CSP) brings all the benefits of SemiLEDs’ rugged EF Series FlipChip architecture to an extremely compact emitter, which is simple to integrate using standard tape and reel surface mount manufacturing. This innovation reduces final component cost up to 50%, with a packaging cost reduction of up to 80% over conventional packaging. EC Series products, such as the EC-W1414, enable system-integrators and luminaire manufacturers a direct path to a highly cost effective solution on a per-lumen basis now, with additional viewing angles and die sizes under development.”

While useful for creating compact multi-die white packaged LEDs, the ReadyMount products will provide particular benefit to light-engine and luminaire manufacturers who have previously had to rely exclusively upon packaged die solutions. Incorporating SemiLEDs’ EF Series FlipChip, the electrical contacts are moved to the bottom of the chip leaving an emitting surface that is uninterrupted by wire bonds or top-side electrodes. The result is a compact chip scale package, only 0.4mm high, which can produce outputs of up to 300 lumens at 1A. The SemiLEDs EC series is available in standard ReadyWhite™ correlated color temperatures ranging from 2700K to 10,000K with color rendering indices up to 90 minimum.

In addition to the manufacturing benefits of the chip scale package, elimination of the wire bonds also improves the optical integration characteristics by taking advantage of the unobstructed and nearly edge-to-edge emitting chip surface which enables the die to be mounted very close together. This simplifies the optics by eliminating the need for complex mixing lenses which are used to control ghosting and shadows in narrow beam applications. The glass top surface is also very mechanically robust, and is not prone to the handling damage or stresses faced by wire-bond or flip chips with a silicone covering. The typical 145 degree field of view also demonstrates good color-over-angle characteristics as a result of the ReadyWhite technology.

By enabling densely packed mounting with simplified optics, the SemiLEDs EC series is ideal for general lighting applications including indoor and outdoor lighting, architectural lighting, and torches/flashlights. The rugged architecture and compact size of the single white die are additionally well suited for mobile device flashes and LCD backlighting applications.

SemiLEDs’ CSP series of LED chips is RoHS compliant with production quantities available now. For completed product information, please visit or email

About SemiLEDs Corp:
SemiLEDs develops and manufactures LED chips and LED components primarily for general lighting applications, including street lights and commercial, industrial and residential lighting, along with specialty industrial applications such as ultraviolet (UV) curing, medical/cosmetic, counterfeit detection, and horticulture. SemiLEDs sells blue, white, green and UV LED chips.


Samsung LED Pushes Efficiency of Mid-power Packages to Higher Levels

Samsung LED Pushes Efficiency of Mid-power Packages to Higher Levels Samsung Electronics has announced that it has made an important upgrade in the luminous efficacy of its mid-power LED package. The LM301B was introduced to the market with the industry’s highest light efficacy among mid-power LED packages in 2017. Now, it has enhanced the efficacy considerably ... Read more »


Enforcement of B.O.S.E. Patents: A Continuous Success

Enforcement of B.O.S.E. Patents: A Continuous Success White light generation is one of the most fascinating topics the LED industry deals with. The silicate-based white LED technology enables white LEDs to be produced with higher accuracy and increased brightness. Preferred applications for these kinds of LEDs are smartphones, notebooks, navigation ... Read more »


LED Patent Lawsuit

Tridonic initiated patent lawsuits against telecommunication retailer S-KON eKontor24 GmbH. Although District Court Munich I affirmed Tridonic’s arguments, parties agreed on a settlement for reasons of legal certainty and prompt settlement of the dispute. Read more »


Proof Your Blue Light Hazard Risk: Stray Light Corrected CAS 140D

Proof Your Blue Light Hazard Risk: Stray Light Corrected CAS 140D With the stray light corrected CAS 140D Instrument Systems – as a technical pioneer – is the first to offer an array spectrometer that can reliably assess the blue light hazard from light sources within the prescribed limiting values. Hitherto only double monochromators were recommended for this ... Read more »


Edison Opto Unveils Two Novel-Designed Products in EdiPower Series

Edison Opto Unveils Two Novel-Designed Products in EdiPower Series Edison Opto, a global LED lighting manufacturer, unveils two new products in EdiPower Series for broad lighting applications. First, the Tunable Series with superior CRI of 95 supports two output channels to enable two dimming options to dim LED lighting without a brightness drop. In addition, the ... Read more »


Cree Launches Industry’s First Extreme Density LED

Cree Launches Industry’s First Extreme Density LED Cree announces the new XLamp® XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5½ times higher lumen density than Cree’s previous generation of high power LEDs. The XD16 LED combines breakthrough lumen density, low optical cross-talk, unsurpassed thermal contact and ease of ... Read more »


Samsung LED Introduces New High-Efficiency Linear Module

Samsung LED Introduces New High-Efficiency Linear Module Samsung launched H inFlux, a linear module designed for industrial lighting applications such as warehouses, factories and covered parking lots where high lumen intensity and light efficacy are required. The H inFlux uses the LM301B, Samsung’s mid-power LED with the industry’s highest light ... Read more »


Future-Proof Your Luminaire Connections with HEKLA

Future-Proof Your Luminaire Connections with HEKLA HEKLA is a versatile solderless connector and another great innovation from the LEDiL design team. HEKLA is compatible with a wide range of existing optics by LEDiL as well as a large number of COB LEDs and its robust, low profile design ensures constant pressure between the COBs and heatsink. Read more »


High Conductive Foils Enabling Large Area Lighting

High Conductive Foils Enabling Large Area Lighting Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as one of the leading partners for research and development for surface technologies and organic electronics and Sefar AG, a leading manufacturer of precision fabrics from monofilaments, developed a roll-to-roll ... Read more »