Products, Materials & Tools | Dec 14, 2012

Toshiba to Start Sales of White LED Packages Based on GaN-on-Si Technology

Toshiba Corporation today announced that the company will start sales of white light-emitting diode (LED) packages that offer makers of general purpose and industrial LED lighting solutions a cost-competitive alternative to current LED packages. Mass production will start this month.

Production of LED chips is typically done on 2- to 4-inch wafers with an expensive sapphire substrate. Toshiba and Bridgelux, Inc. have developed a process for manufacturing gallium nitride LEDs on 200mm silicon wafers, which Toshiba has brought to a new production line at Kaga Toshiba Electronics Corporation, a discrete products manufacturing facility in northern Japan. Mass production of packages using the new line’s output starts this month.

Deployment of Toshiba and Bridgelux’s new gallium nitride-on-silicon (GaN-on-Si) technology to produce LED chips has allowed Toshiba to replace sapphire substrates and to produce the chips on a much more cost-competitive silicon substrate.

The low power consumption and long life of the white LED lighting is winning wide adoption in general purpose lighting, TV backlighting and other areas of application. In FY2011 the global market stood at 700 billion yen (approximately US$8.5 billion) and it is expected to almost double to 1,250 billion yen ($15.2 billion) in FY2016.

Going forward, Toshiba will promote product development and global sales toward securing a 10% share of the world market in FY2016.

Product Outline
Product name:                                    TL1F1 series (1W)
Size:                                                    6.4 mm (L) x 5.0 mm (W) x 1.35 mm (H)
Light flux:                                            112 lm (at 350mA)
Mass Production start:                        December 2012
Production capability (planned):         10,000,000 units per month 

About Toshiba:
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry's broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa.
Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturer and marketer of advanced electronic and electrical products spanning digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances. Founded in 1875, Toshiba today operates a global network of more than 490 companies, with 203,000 employees worldwide and annual sales surpassing US$77 billion.
For more information visit Toshiba Electronics Europe's web site at www.toshiba-components.com

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