Products, Materials & Tools | Sep 02, 2010

Tyco Electronic's Solderless Socket Solution Now Ready for Shipping

Tyco Electronics (TE), a global leader in engineered electronic components and solutions, releases the solderless LED socket, Type CM (see also LpO News - May 26, 2010) , for easy integration of the new Cree XLamp® MP-L™ multichip LED into light fixtures. Introduced as a development program at LIGHTFAIR® International 2010, the product family is now available for production orders.

The new socket offers customers a simple termination solution for the Cree XLamp MP-L LED while allowing ample optical clearance for un-lensed applications. For lensed applications, the socket incorporates a snap-on connect feature for the LEDIL Tyra series of reflectors, which offer directional optics in 18, 30 and 50 degree beam angles.

The solderless LED socket provides a rapid termination solution for the XLamp MP-L LED’s six 0.60mm2 connection pads that are mounted on the top of the LED. This low-profile socket eliminates the need to solder by providing a solderless solution that reduces assembly time while providing a repeatable and separable termination. In addition, the socket is conveniently offered in two versions to suit wire or board applications -- each version is offered with or without attachment features for optics. A third version with an inverted connection option will be available in late September 2010.

The wire termination version incorporates a TE AMP mini CT connector header that mates to a cable mounted AMP mini CT plug -- allowing for quick, easy wire connections. This version eliminates the need for a circuit board and allows the XLamp MP-L LED to be mounted directly to the heat sink using a thermally conductive adhesive. A six-inch AMP mini CT pigtail assembly is also offered to provide a complete interconnect solution for the XLamp MP-L LED implementation.

The board termination version, suitable for PCB-mount applications, provides a solderless termination directly to the PCB from the XLamp MP-L LED. This version suits applications where drive circuitry and remote connectors are integrated onto the same board as the LED. 

The socket design, recognized to UL 1977 requirements (file #E28476), utilizes standard commercially- available hardware for attachment.

To learn more about TE’s new solderless LED socket, visit http://www.te.com/catalog/minf/en/763?BML=10000-L,23305 or call us at 800-522-6752
To view the product demonstration video, please visit: http://www.youtube.com/watch?v=Lqlrz1szBcs
For more information on TE’s full line of SSL products, please visit www.te.com/lighting

About Tyco Electronics:
Tyco Electronics Ltd. is a leading global provider of engineered electronic components, network solutions, specialty products and undersea telecommunication systems, with fiscal 2009 sales of US$10.3 billion to customers in more than 150 countries. We design, manufacture and market products for customers in a broad array of industries including automotive; data communication systems and consumer electronics; telecommunications; aerospace, defense and marine; medical; energy; and lighting. With approximately 7,000 engineers and worldwide manufacturing, sales and customer service capabilities, Tyco Electronics' commitment is our customers' advantage. More information on Tyco Electronics can be found at http://www.te.com/.

FEATURED

Cree Launches Industry’s Highest Efficacy 90 CRI COB LEDs

Cree Launches Industry’s Highest Efficacy 90 CRI COB LEDs Cree, Inc. announces the XLamp® eTone™ LEDs, a breakthrough set of chip-on-board (COB) LEDs that delivers beautiful 90 color rendering index (CRI) light quality at the same efficacy as today’s standard 80 CRI LEDs. Delivering up to 155 lumens per watt (LPW) at 3000 K CCT, 85°C, Cree’s new eTone COB ... Read more »

FEATURED

Luminus Gen 4 COBs: 70W CMH Spots Finally Meet Their Match

Luminus Gen 4 COBs: 70W CMH Spots Finally Meet Their Match Luminus Devices latest, fourth generation chip-on-board LED technology (Gen 4) will open new opportunities in retail lighting and a wide range of indoor and outdoor lighting applications. Luminus Gen 4 COB technology combines significant improvements in efficacy, flux density, high maximum drive ... Read more »

EDITORIAL

High Conductive Foils Enabling Large Area Lighting

High Conductive Foils Enabling Large Area Lighting Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as one of the leading partners for research and development for surface technologies and organic electronics and Sefar AG, a leading manufacturer of precision fabrics from monofilaments, developed a roll-to-roll ... Read more »

page_peel