IP, Reports & Roadmaps | Mar 16, 2007

Light Emitting Diode Package with Diffusor and method of manufacturing the same

The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
Add comment

You can add a comment by filling out the form below. Plain text formatting. Comments are moderated.

Question: What is 1 + 6 ?
Your answer:
FEATURED

Edison Released Brand New DOB III Series Products

Edison Released Brand New DOB III Series Products The DOB III series increased the efficiency, dimming smoothness also provide ultra- low flicker function (flicker 5% and even 5% during dimming). It is compliant to the 2021 European flicker standard IEC TR61547( PstLM) and to CIE TN006 (SVM) on request. It can be applied in many different lighting ... Read more »

FEATURED

Versatile and Ultrafast – The New CAS 125 Series of Spectroradiometers for LED Production

Versatile and Ultrafast – The New CAS 125 Series of Spectroradiometers for LED Production Instrument Systems – a well-known manufacturer of light measurement technology – works closely with its customers in the field of LED production to develop modular and flexible components for quality inspection in mass production environments. For the new spectroradiometer CAS 125, Instrument ... Read more »