Technologies | Engineering | Systems | Mar 21, 2014

Not Just Light Generation - Xicato Calls It "Internet of Lights" or Lighting 2.0

Key properties and features of Lighting 2.0 and the Internet of Lights Xicato, in cooperation with Echelon will demonstrate a new integrated controls approach. What Xicato understnds when saying "Internet of Lights" is already explained shortly on their website. If you are interested in topic like this, don't miss LpR 43. Read more »

Technologies | Electronics | LiFi | Jan 14, 2014

Enhanced Data Transmission for Li-Fi Communications using LED Lighting

Experimental set-up of a Li-Fi receiver Despite continuous improvements in wireless communication technology, e.g. 3G, LTE, 4G etc., a looming crisis is anticipated due to a lack of sufficient radio frequency bandwidth to support the growth in demand for data transmission, in the so called “Spectrum Crunch”. Visible Light Communication (Li-Fi) offers an economical solution. LED lighting is now widely deployed and can, in parallel with its primary function, also be used for wireless communication. Li-Fi demonstrates significant improvements in security, safety and capacity over radio frequency communication, and ease of deployment as compared with fibre-optic cable. The LED link is untethered, enables links with many mobile devices, and is independent of any one host. Improvements to the data rate achievable using LEDs as the transmitter allows services based on Li-Fi concept to outperform other communication modes. Read more »

FEATURED

Light Diffusing Polyurethane LED Potting Compound

Light Diffusing Polyurethane LED Potting Compound UR5635 light diffusing polyurethane LED potting compound is a two-part, semi-rigid polyurethane resin which has been formulated to have a light diffusing effect. Its cloudy appearance offers a unique light diffusion effect which has seen UR5635 used to great success as an LED potting compound for ... Read more »

FEATURED

Epoxy Features Very Low Coefficient of Thermal Expansion

Epoxy Features Very Low Coefficient of Thermal Expansion Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Read more »

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