Thermal Management

Technologies | Thermal Management | Jun 24, 2015

Litecool Turns LED Packaging on Its Side

Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode. Read more »

Resources | White Papers | Thermal Management

WHITE PAPER: "High Intensity UV LED Sources Enabled by Next Generation Substrates"

Thermal management of high-power UV LEDs is substantially more demanding than for white LEDs. This arises due to their lower efficacy combined with the end use requirement for intense light sources. Critical to the thermal management of densely packed LED arrays is the substrate the semiconductors are mounted on. This whitepaper investigates how next generation Nanoceramic substrates can benefit the LED industry and presents a case study of a 75W UV LED module, just 2cm². Read more »

Technologies | Thermal Management | Jul 30, 2013

NRL Researchers Discover Novel Material for Cooling of Electronic Devices

A team of theoretical physicists at the U.S. Naval Research Laboratory (NRL) and Boston College has identified cubic boron arsenide as a material with an extraordinarily high thermal conductivity and the potential to transfer heat more effectively from electronic devices than diamond, the best-known thermal conductor to date. Read more »