Products, Materials + Tools | Mar 07, 2012

Plansee's Newly Developed Mo-Cu R670 Prevents Cracks in LED Semiconductor Layers

With Mo-Cu R670, PLANSEE has developed a new molybdenum-copper composite material for semiconductor wafer substrates. The material ensures optimized heat dissipation in LED chips.

In the most commonly used process for the production of blue spectrum chips - including white LEDs - gallium nitride-based semiconductor layers (GaN) are grown on sapphire substrate (Al2O3) using epitaxial growth methods like MOCVD. A metallic wafer, intended for the dissipation of heat, is then bonded to the semiconductor layers at high temperatures. Stresses caused by different coefficients of thermal expansion can lead to cracks in the semiconductor layers. To prevent these defects, the metal wafer ideally possesses the same coefficient of thermal expansion (CTE) as sapphire.

Molybdenum is commonly used for such wafer substrates. This material offers good thermal conductivity and is very heat-resistant. However, molybdenum has a lower coefficient of thermal expansion than sapphire (Al2O3). That’s why we developed wafer substrates made from the molybdenum-copper composite material R670 especially for sapphire-based and high temperature-bonded LED chips. R670 has a thermal conductivity of 170 W/mK and, with 6.7 ppm/K, the same coefficient of thermal expansion as sapphire (Al2O3).

For additional information please visit http://www.plansee.com/en/About-us-Business-sectors-LED-megatrend-287.htm

About Plansee:
PLANSEE can supply Mo-Cu wafer substrates with coatings made from nickel-gold, ruthenium, chromium, silver and other interface materials. These coatings protect the wafer substrate against corrosion and optimize its surface properties for the subsequent bonding process.
As one of the world's leading manufacturers of refractory metals and composite materials, PLANSEE supplies metallic wafer substrates for heat dissipation and also numerous other components for the production of LED chips and LED packages. These include furnace components and molybdenum and tungsten crucibles for sapphire single crystal growth, components for MOCVD/MBE reactors, evaporation boats and coils for metallic mirror or barrier layers and base plates for improved thermal management of high-power LEDs. Get to know more about our high performance materials for the LED industry and our wafer carriers.

FEATURED

Edison Released Brand New DOB III Series Products

Edison Released Brand New DOB III Series Products The DOB III series increased the efficiency, dimming smoothness also provide ultra- low flicker function (flicker 5% and even 5% during dimming). It is compliant to the 2021 European flicker standard IEC TR61547( PstLM) and to CIE TN006 (SVM) on request. It can be applied in many different lighting ... Read more »

EDITORIAL

Würth Elektronik's Power-Saving WL-SMTW: Colors for Feeding Plants

Würth Elektronik's Power-Saving WL-SMTW: Colors for Feeding Plants SMT mountable LEDs in a 2835 package extend Würth Elektronik extensive range of horticulture LEDs. The three WL-SMTW series LEDs emit light of the wavelengths 450 nm (Deep Blue), 660 nm (Hyper Red) and 730 nm (Far Red) – ideal for applications controlling plant growth through specific light ... Read more »

EDITORIAL

Higher-Performance UV-C Solutions from Lumitronix Feature Nichia's New NCSU334B UVC LED

Higher-Performance UV-C Solutions from Lumitronix Feature Nichia's New NCSU334B UVC LED Following the successful introduction of the first UVC LED modules in August 2020, LED expert Lumitronix from Hechingen is expanding the existing concept of linear module solutions with three new, more powerful versions. These are as well mainly addressed to professional customers who are trained ... Read more »

EDITORIAL

Nexperia Launches Industry-First LED Drivers in DFN Package with Side-Wettable Flanks

Nexperia Launches Industry-First LED Drivers in DFN Package with Side-Wettable Flanks Nexperia, the expert in essential semiconductors, today announced a new range of LED drivers in the space-saving DFN2020D-6 (SOT1118D) package. This case style features side-wettable flanks (SWF) which facilitate the use of AOI (automated optical inspection), and improve reliability. This is the ... Read more »