Products, Materials & Tools | Oct 13, 2010

Extruded Alunit Ceramics – World Premiere of a New Thermal Management Material

CeramTec GmbH has succeeded in achieving series extrusion of exceptionally thermally conductive aluminum nitride ceramics. This process is the world's first and enables rod-shaped bodies and tube systems made of ceramic with a thermal conductivity of ≥ 170W/mK, high mechanical stability and dielectric strength.

The production phase enables technical reproducibility along with an efficient manufacturing method even for large quantities. Currently, diameters of 0.98mm to approx. 35mm are possible. The minimum wall thickness is 0.2mm; the maximum length is 250mm. With approx. 4.1 ppm/K, Alunit has a thermal expansion coefficient rivaling that of silicon (approx. 4 ppm/K) and also exhibits uniform thermal conductivity and expansion in all directions. It produces virtually no thermal stress in the soldering layer between the chip and the substrate.

AIN ceramics boast a wide range of applications - from passive components and module substrates to liquid cooling. Pairing these properties with a direct metallization, a patented method developed by CeramTec GmbH, brings even more advan-tages to the areas of thermal management, electrical insulation and system reliability.

More on Metallized Ceramics
Ceramic materials are often underestimated. But ceramics, such as Rubalit (Al2O3) or Alunit (AlN), marry two decisive characteristics: electrical insulation and thermal conductivity. Ceramics are dimensionally stable, meet ROHS standards and are corrosion resistant against salt, acid and lye. Fully inert, ceramic material is the last system component to fail. Pairing these properties with a direct ceramic metallization makes things even more interesting. Metallization pads provide bonding surfaces and make it possible to print individual conductor path layouts on all sides. The outlined combination of circuit board and ceramic heat sink for the reliable cooling of thermally sensitive components and circuits is a CeramTec GmbH development known as CeramCool. The ceramic system efficiently deflects heat without creating thermal barriers and measurably relieves the burden placed on components. The simplified construction (no glues, insulation layers, etc.) combined with a direct and permanent bond between the electronic component and CeramCool, e.g. via a soldered joint, create ideal operating conditions for the entire assembly.

Metallizations made of tungsten, tungsten-nickel, tungsten-nickel-gold, gold, silver, silver-palladium, silver-platinum and DCB are available. DCB stands for Direct Copper Bonded – direct bonding of copper films with a ceramic insulator and substrate, generally made of Rubalit or Alunit. It is recommended for high-power electronics applications and high current strengths.

FEATURED

MOSO High Reliable & Flexible Programmable Outdoor LED Driver

MOSO High Reliable & Flexible Programmable Outdoor LED Driver MOSO, one of the most influential and well-known new energy enterprises in China, dedicates to provide the efficient, intelligent and safe outdoor LED power supply solutions by introducing its programmable LDP series worldwide. Read more »

FEATURED

Cree Launches Industry’s First Extreme Density LED

Cree Launches Industry’s First Extreme Density LED Cree announces the new XLamp® XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5½ times higher lumen density than Cree’s previous generation of high power LEDs. The XD16 LED combines breakthrough lumen density, low optical cross-talk, unsurpassed thermal contact and ease of ... Read more »

FEATURED

Lumileds Delivers up to 48% Higher “Punch” than Competitors

Lumileds Delivers up to 48% Higher “Punch” than Competitors Lumileds introduced today the Luxeon CZ Color Line, a product line optimized to deliver maximum punch. “The Luxeon CZ features up to 48% higher punch than any other undomed color LED,” said Jennifer Holland, Product Line Director of the Luxeon Color Family. To meet the recent market trend of color ... Read more »

FEATURED

LIFUD High Bay LED Driver & Smart Sensor

LIFUD High Bay LED Driver & Smart Sensor LIFUD just launched her second generation of high bay driver, LF-FHB series. It can be completely turned OFF even without cutting off the AC power. When the second generation of LF-FHB series works with a smart sensor (= microwave sensor + light sensor) which was developed by LIFUD R&D, the light ... Read more »

EDITORIAL

High Conductive Foils Enabling Large Area Lighting

High Conductive Foils Enabling Large Area Lighting Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as one of the leading partners for research and development for surface technologies and organic electronics and Sefar AG, a leading manufacturer of precision fabrics from monofilaments, developed a roll-to-roll ... Read more »

page_peel