Thermal Management

Products, Materials + Tools | Jul 19, 2010
Insulated Metal Substrate - DENKA HITTPLATE
Insulated Metal Substrate - DENKA HITTPLATE DENKA HITTPLATE is an insulated metal substrate with high thermal conductivity for processing metal circuit boards (PCB´s). It consists of fine quality epoxy-resin filled with inorganic filler with high thermal conductivity. It achieves low thermal resistance equivalent to or even less than Alumina ceramics substrate. Read more »
Products, Materials + Tools | Jul 20, 2010
NuSil Technology Adds Low Outgassing Thermal Interface Material to Electronics Lineup
NuSil Technology, a cutting-edge manufacturer of silicone-based materials for aerospace, electronics, photonics, and healthcare, announces the addition of EPM-2495 to its electronics lineup. EPM-2495 is a low outgassing, thermal interface silicone material designed to allow a bond line thicknesses of =50 micron to reduce thermal resistance. Read more »
Products, Materials + Tools | Jul 21, 2010
Mounting Tape Provides up to Three Times the Thermal Conductivity of Competing Tapes
Mounting Tape Provides up to Three Times the Thermal Conductivity of Competing Tapes MH&W International has introduced Keratherm® KL 90 highly thermally conductive, double-sided adhesive tape which provides 1.4 W/mK of thermal conductivity – nearly three times higher than other thermal tapes – for more effective heat transfer from hot components to heat sinks. The new tape’s thermal impedance is just 208°C-mm2/W (0.32°K-in2/W). Read more »
Products, Materials + Tools | Jul 22, 2010
Nextreme Ships New Optocooler HV14 High Voltage, Low Current Thermoelectric Module
Nextreme Ships New Optocooler HV14 High Voltage, Low Current Thermoelectric Module Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the first customer shipment of the new OptoCooler HV14 thermoelectric cooler, the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard circuitry and power requirements. Read more »
Products, Materials + Tools | Jul 22, 2010
Silicone-Free Interface Material Provides High Thermal Conductivity
Silicone-Free Interface Material Provides High Thermal Conductivity MH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices. Read more »
Products, Materials + Tools | Jul 22, 2010
CeramCool® Optimized for 4W Cooling
CeramCool® Optimized for 4W Cooling The optimized geometry allows operation of a 4W LED at a maximum temperature of 60°C and reduces the temperature at the hot-spot by 6°C resulting in a significant reduction of stress on a critical component. This means the thermal resistance of the Rubalit ceramic assembly for an identical shape is 13% better than aluminum. Read more »
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