IP, Reports & Roadmaps | Jul 05, 2006

Semiconductor light emitting diode having textured structure and method of manufacturing the same

Cross sectional view of a semiconductor light emitting diode A semiconductor light emitting diode having a textured structure and a method of manufacturing the semiconductor light emitting diode are provided. The method includes forming a first semiconductor layer on a substrate; forming a textured structured first semiconductor layer by penetrating a material of a material layer into the first semiconductor layer after the material layer is formed on the first semiconductor layer and annealed; and forming a second semiconductor layer on the first semiconductor layer. Read more »

IP, Reports & Roadmaps | Jun 27, 2006

LED lighting system

Block diagram of a portion of an LED based lighting system Method and system are disclosed for compensating for color variations due to thermal differences in LED based lighting systems. The method and system involves characterizing the LEDs to determine what PWM (pulse-width modulation) is needed at various operating temperatures to achieve a desired resultant color. The characterization data is then stored in the microprocessor either in the form of a correction factor or as actual data. When an operating temperature that is different from a calibration temperature is detected, the characterization data is used to adjust the PWM of the LEDs to restore the LEDs to the desired resultant color. Read more »

IP, Reports & Roadmaps | Jun 22, 2006

Organic light emitting diode (oled) having improved stability, luminance, and efficiency

Simplified cross section view of an organic light emitting diode (OLED) An organic light emitting diode (OLED) includes a relatively thin diamnond-like carbon (DLC) layer disposed between the anode and the hole transport layer to improve luminous efficiency and operating life time. The relatively thin DLC layer inhibits hole injection, which balances charge flow and improves efficiency, and increases the surface smoothness of the anode, which contributes to the increased operating life time. Read more »

IP, Reports & Roadmaps | Jun 22, 2006

Thin gallium nitride light emitting diode device

Flow chart showing the process for manufacturing a unit chip of a thin GaN LED Disclosed is a light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded. Preforms for manufacturing the LED device and a method for manufacturing the LED device are also disclosed. The sapphire substrate, on which the crystal structure of the light emitting diode has grown, is processed into a unit chip before being removed. Thus, any crack in the crystal structure of the light emitting diode that may occur during the removal of the sapphire substrate can be prevented. Therefore, a thin light emitting diode device can be manufactured in a mass production system. Read more »

IP, Reports & Roadmaps | Jun 08, 2006

Programmable driving method for light emitting diode

Schematic view of an organic light emitting diode A programmable driving method for light emitting diode is disclosed, which is capable of providing a programmable multi-phase segment and a corresponding programmable multi-phase actuating signal to an LED with respect to user specification, such that an optimal driving sequence can be provided to the LED according to the requirements of the manufacturing process of a LED display and thus enabling the performance of the gray levels displayed by the LED display to be optimized. Read more »

IP, Reports & Roadmaps | Jun 08, 2006

Light emitting diode package having multiple molding resins

Sectional view illustrating a light emitting diode package Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented. Read more »

IP, Reports & Roadmaps | Mar 30, 2006

New materials for high efficiency organic solid state lighting

An organic light-emitting device (OLED) structure shows the emission layer which incorporates new charge-transporting organic phosphine oxide molecules (top right) as high triplet energy hosts for blue organometallic phosphors (blue dots). A new organic molecule developed by PNNL (Pacific Northwest National Laboratory) scientists may significantly improve the efficiency of organic solid state lighting. Read more »

News-Spot | IP, Reports & Roadmaps | Mar 01, 2002

IST Obtains Further UK LED & OLED Driver Patent to Improve Efficiency and Reduce Ripple Current Through SSL Loads

Integrated System Technologies (IST) Ltd announced today the issuing by the UK Patent Office of its patent that covers power supply technologies for the rapidly expanding LED and OLED lighting sector. Read more »

White Paper | Standardization & Regulation

Solid State Lighting for Incandescent Replacement—Best Practices for Dimming

This paper focuses on integrated LED lamps intended for replacement of general service incandescent lamps. Future white papers are planned to address other LED dimming topics, such as: color change; light output and efficiency (dimming curve); dimming protocols (Internet protocols, 0-10); LED modules with auxiliary drivers; and control architectures that dim without modulated power. Read more »

IP, Reports & Roadmaps

Flip-chip light emitting diode with high light-emitting efficiency

Schematic drawing of a flip-chip type LED in accordance with the present invention. A flip-chip light emitting diode with high light-emitting efficiency is disclosed. The LED includes a transparent conductive layer, an oxide layer, a reflective metal layer, a conductive layer, and a protective diffusion layer sequentially disposed over a p-type semiconductor layer. Thereby, light emitting from a light-emitting layer toward the p-type semiconductor layer is reflected and penetrating a transparent substrate and emitting outwards. Thus the problem of light shielded from the flip-chip type LED is solved and the light-emitting efficiency is improved. Furthermore, the present invention disposes the LED chip in a face-down orientation on a conductive substrate by flip-chip technology so as to enhance heat-dissipation efficiency of the LED. Read more »

Standardization & Regulation

LED Lighting Standard Organizations

Jianzhong Jiao, Ph.D. - Osram Opto-Semiconductor Read more »

EDITORIAL

WEBINAR (May 14th): How to Achieve Better Products to the Eye Through Virtual Prototyping?

WEBINAR (May 14th): How to Achieve Better Products to the Eye Through Virtual Prototyping? In the CADFEM webinar on May, 14, 2020 you will learn, how physics-based simulations - virtual prototyping - contribute to develop better lighting products. The live presentation pictures the whole process - from editing the geometric model to the definition of light sources and sensors to the use ... Read more »

EDITORIAL

EuControls Introduces Its Zigbee Compatible Ceiling Mount Multi-Sensor 810-PLT-DZB

EuControls Introduces Its Zigbee Compatible Ceiling Mount Multi-Sensor 810-PLT-DZB EuControls is excited to announce the addition of a compact ceiling mount multi-sensor/controller to its growing wireless lighting controls product portfolio. The S810-PLT-DZB is a unique Zigbee compatible energy management device aimed at new and retrofit indoor lighting projects that require ... Read more »

EDITORIAL

Selecting the UV LED Wavelength for Purification Applications

Selecting the UV LED Wavelength for Purification Applications Patrick Durand is the Worldwide Technical Director at Future Lighting Solutions (FLS) with over 15 years of experience in the solid state lighting industry. Patrick leads the FLS Technical Marketing teams and FLS laboratory teams located in multiple regions around the world with the objective of ... Read more »

EDITORIAL

Nichia Showcases LEDs with 'Light so Good'

Nichia Showcases LEDs with 'Light so Good' At Light + Building 2020 held in Frankfurt, Nichia – the leader in high-performance LED solutions – reveals it will present at least three complementary technologies to improve the delivery of light quality under an over-arching banner of 'Light so Good'. Read more »