IP, Reports & Roadmaps | Sep 17, 2007

NICHIA ANNOUNCES EXPANDED PATENT CROSS LICENSE WITH CREE AND FILES LAWSUITE AGAINST SEOUL SEMICONDUTOR LTD IN KOREA

Nichia Corporation today announced that Nichia and Cree, Inc. (Nasdaq: CREE) have entered into an agreement that expands their cross license arrangements announced in 2002 and 2005 to include additional patents relating to white LED technology and certain Cree patents relating to nitride lasers. At the same time Nichia filed a lawsuit in the Seoul Central District Court against Seoul Semiconductor Co., Ltd. ("Seoul Semiconductor") for infringing Nichia's patent. Read more »

IP, Reports & Roadmaps | Aug 31, 2007

Seoul Semiconductor, Korea and OSRAM, Germany Have Signed a Patent Cross License Agreement

Jae Jo Kim, Executive Vice President of Seoul Semiconductor and Gerd Pokorny, Senior Vice President of OSRAM GmbH signed cross license agreement Seoul Semiconductor (KOSDAQ; 046890), the eighth-largest LED manufacturer in the world, announced today that it has signed a patent cross-license agreement with OSRAM GmbH, a leading LED manufacturer based in Munich, Germany. Under this agreement, Seoul Semiconductor and OSRAM including its wholly-owned subsidiary OSRAM Opto Semiconductors of Regensburg, Germany, will share their patents pertaining to white and visible LED technologies. Read more »

IP, Reports & Roadmaps | Aug 30, 2007

ITC Denies Epistar`s Motion to Stay Exclusion Order in Investigation Initiated by Philips Lumileds

The United States International Trade Commission (ITC) has denied Epistar`s motion to stay the ITC`s Exclusion Order barring importation of Epistar`s OMA, MB and GB LEDs. After the ITC ruled that Epistar`s current AlInGaP LEDs infringe Philips Lumileds` patent rights and issued an exclusion order banning importation of those LEDs, Epistar filed motions before both the ITC and the U.S. Court of Appeals for the Federal Circuit to stay enforcement of the exclusion order. The ITC has denied Epistar`s motion. Read more »

IP, Reports & Roadmaps | Aug 20, 2007

Nitride based LED with a p-type injection region

Schematic drawing of a LED with a p-type injection region. An LED chip (2) is composed of a p-GaN layer (10), an n-GaN layer (14), and an MQW emission layer (12) that is sandwiched between the GaN layers (10 and 14). Each layer is made of a GaN semiconductor. Light exits the LED chip (2) through the n-GaN layer (14). A p-electrode (16) of the LED chip (2) has a surface profile (24B) defined by a plurality of columnar projections (24A) formed in a uniformly distributed relation on the surface facing toward the p-GaN layer (10). The p-electrode (16) is in contact with the p-GaN layer (10) at the top surface of each projection (24A). Read more »

IP, Reports & Roadmaps | Aug 20, 2007

Light emitting diode package

Schematic drawing of the improved LED package. Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum. Read more »

IP, Reports & Roadmaps | Aug 13, 2007

Flip-chip light emitting diode with high light-emitting efficiency

Schematic drawing of a flip-chip type LED in accordance with the present invention. A flip-chip light emitting diode with high light-emitting efficiency is disclosed. The LED includes a transparent conductive layer, an oxide layer, a reflective metal layer, a conductive layer, and a protective diffusion layer sequentially disposed over a p-type semiconductor layer. Thereby, light emitting from a light-emitting layer toward the p-type semiconductor layer is reflected and penetrating a transparent substrate and emitting outwards. Thus the problem of light shielded from the flip-chip type LED is solved and the light-emitting efficiency is improved. Furthermore, the present invention disposes the LED chip in a face-down orientation on a conductive substrate by flip-chip technology so as to enhance heat-dissipation efficiency of the LED. Read more »

IP, Reports & Roadmaps | Aug 13, 2007

Seoul Semiconductor Wins Patent Case in Taiwan

Seoul Semiconductor (KOSDAQ: 046890), one of the ten largest LED manufacturers in the world, announced today that a Taiwan Intellectual Property Office has ruled that the invalidation action brought by Advanced Optoelectronic Technology Inc.(AOT) against Seoul Semiconductor s white LED patent in Taiwan is not sustained. Read more »

IP, Reports & Roadmaps | Aug 06, 2007

Packages for semiconductor LEDs utilizing dispensed reflectors and methods of forming the same

Cross sectional view according to some embodiments of the invention. A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED includes forming a first meniscus control feature on a substrate and defining a first region of the substrate, forming a second meniscus control feature surrounding the first region and defining a second region of the substrate between the first meniscus control feature and the second meniscus control feature, mounting an LED chip within the first region, dispensing a first encapsulant material including a reflective material within the second region, curing the first encapsulant material, dispensing a second encapsulant material on the substrate within the first region, and curing the second encapsulant material. Read more »

IP, Reports & Roadmaps | Aug 03, 2007

Color sensor integrated light emitting diode for LED backlight

LED package integrated with color sensor according to the present invention. A color sensor integrated light emitting diode (LED) is packaged with LED and color sensor mounted side by side inside LED package comprising a heat sink for mounting LED and the color sensor, both the color sensor and LED being buried by a high refractive index polymer followed by a diffuser layer and light extraction layer, all of which are transparent. Posts electrically linked to LED and color sensor inside the package are provided for external connection to LED and color sensor. Plurality of color sensors and LEDs can be packaged inside a single package with proper orientation of desired color LEDs to receive desired color by color sensors. Color change at the very source of light emission can be controlled with color sensor integrated LED package more effectively than conventional methods. Plurality of these packages can be employed for LED backlight for LCD, consumer lighting, decorative lighting and signage displays. Read more »

IP, Reports & Roadmaps | Aug 01, 2007

Integrated led chip to emit multiple colors and method of manufacturing the same

Manufacturing process for the present invention. The present invention is a monolithic, multi-colored LED chip and a method for making the same. The LED chip is comprised of a substrate and a plurality of light emitting structures, each light emitting structure capable of emitting a wavelength of light unique compared to others and each structure layered on top of another structure and separated by a dielectric layer. The light emitting structures are then capable of independent or tandem activation, yielding the original colors of each section, blends of colors, and white light. The method starts with the base for such a chip and etches layers of the chip away, leaving exposed sections, to reach electrical contact layers for each light emitting structure. Electrically conductive material is then used to fill the exposed sections and is, in turn, etched away to leave contacts. An insulating material is then used to fill in the resultant areas. Read more »

IP, Reports & Roadmaps | Aug 01, 2007

Color LED driver

Configuration of a color LED driver according to the present invention. Disclosed herein is a color LED driver, which is capable of being implemented by a compact structure without a feedback structure and accompanying a small size and low cost, by directly connecting a negative temperature coefficient (NTC) thermistor to a driving current path of a color LED applied to an LCD backlight to compensate a characteristic variation of the LED due to a variation in a temperature. The color LED driver includes a driving constant voltage source 100 which supplies a predetermined driving constant voltage VD; a driving circuit 200 which converts the driving constant voltage VD of the driving constant voltage source 100 into a plurality of driving currents, for driving color LEDs, the plurality of driving currents including red LED driving current Ird, green LED driving current Igd and blue LED driving current Ibd; a temperature compensation unit 300 which compensates variations in the red LED driving current Ird and the green LED driving current Igd due to a variation in a temperature, among the plurality of driving currents from the driving circuit 200; and an LED unit 400 including a plurality of color LEDs which are turned on by the driving currents from the temperature compensation circuit 300 and the driving current from the driving circuit 200. Read more »

IP, Reports & Roadmaps | Jul 20, 2007

Nexxus Lighting Issued Two New LED Lighting Technology Patents

Nexxus Lighting, Inc. (NASDAQ Capital Market: NEXS) a world leader in advanced lighting technology, including solid-state LED and fiber optic lighting systems and controls used in commercial, architectural, signage, swimming pool and retail lighting today announced that it has been issued two new patents related to its LED lighting technology. Read more »

IP, Reports & Roadmaps | Jul 20, 2007

Settlement of Patent Litigation with OSRAM

Citizen Electronics Co., Ltd. with headquarters in Fujiyoshida-city, Yamanashi, Japan and President, Takashi Masuzawa (“CITIZEN ELECTRONICS”), a totally-held subsidiary of Citizen Holdings Co., Ltd. with headquarters in Nishi-Tokyo city, Tokyo, Japan and President Makoto Umehara, reached a settlement with Osram GmbH Munich, Germany and its subsidiary OSRAM Opto Semiconductors GmbH Regensburg, Germany (collectively “OSRAM”) over patent lawsuit and litigation cases that have been running since 2005, and concluded a settlement agreement on July 13, 2007. Read more »

IP, Reports & Roadmaps | Jul 13, 2007

Philips Lumileds Initiates Notification of Epistar Infringement and ITC Exclusion Order to Chip Packagers and Users of Epistar`s OMA, MB, and GB LED Products

Philips Lumileds is notifying chip packagers, distributors and others using Epistar`s OMA, MB and GB LEDs that the U.S. International Trade Commission (ITC) has issued an order excluding importation of these products into the United States because they infringe Philips Lumileds` patent rights. The exclusion order prohibits importation of Epistar`s infringing LEDs as well as packaged LEDs containing the infringing LEDs and boards primarily consisting of arrays of such packaged LEDs. The Presidential Review period has ended and the ITC`s Exclusion Order is now final and in full force. Read more »

IP, Reports & Roadmaps | Jul 09, 2007

LED drive circuit having temperature compensation

A LED driver circuit in accordance with the present invention. A LED driver circuit is provided for controlling the brightness of a LED. A control circuit is used for generating a LED current in accordance with a resistor. The control circuit is further coupled to detect a LED voltage for adjusting the LED current in reference to the LED voltage. The value of the LED voltage is correlated to the LED temperature. Therefore, the LED current is then programmed in accordance with the LED temperature. Read more »

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