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IP, Reports & Roadmaps | Aug 23, 2006

Sidley Austin LLP announces client settlement of patent infringement claims against LED manufacturer

Sidley Austin LLP announced today that the firm represented Professor Gertrude Neumark Rothschild in her settlement of claims of patent infringement against Toyoda Gosei Co. Ltd., and Toyoda Gosei North America Corporation. Read more »

IP, Reports & Roadmaps | Aug 17, 2006

TIR surpasses milestone of 100 patent filings: TIR'S Leadership in SSL technology creates demand for speaking engagements and technical papers

Vancouver, BC – TIR Systems Ltd. (TSX: TIR), announces that as of August 1, the company has 113 patent applications in addition to six patents already granted in the field of Solid State Lighting (SSL). Read more »

IP, Reports & Roadmaps | Aug 04, 2006

Lighting Science Group is granted eighth patent for advances in LED lighting technologies

DALLAS, Lighting Science Group Corporation (OTCBB:LSGP) announced today that the United States Patent and Trademark Office has granted the company its eighth patent for Optimized Digital Lighting(TM) (ODL(R)) technologies. Read more »

IP, Reports & Roadmaps | Aug 03, 2006

Side view led package having lead frame structure designed to improve resin flow

Front elevation view illustrating a side view LED package mounted with lead frames The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin. Read more »

IP, Reports & Roadmaps | Aug 03, 2006

LED driver

Circuit diagram illustrating an examplary circuit A light emitting diode (LED) driver to drive an LED, including a current adjusting unit to adjust magnitude of a current flowing on the LED by supplying power from a power supply device to the LED and cutting off the power. A modulation control unit is provided to modulate a waveform of the current flowing on the LED by controlling the adjustment operation of the current adjusting unit. A constant current offset unit to control the adjustment operation of the current adjusting unit is provided so that the current flowing on the LED is higher or equal to a predetermined value as the waveform thereof is modulated. Thus, provided is an LED driver having improved power consumption efficiency. Read more »

IP, Reports & Roadmaps | Jul 20, 2006

Method of making a vertical light emitting diode

SEM image of a light extracting LED Methods are disclosed for forming a vertical semiconductor light emitting diode (VLED) device having an active layer between an n-doped layer and a p-doped layer; and securing a plurality of balls on a surface of the n-doped layer of the VLED device. Read more »

IP, Reports & Roadmaps | Jul 05, 2006

High output light emitting diode and method for fabricating the same

High output LED bonded to a reflective plate to emit light A high output light emitting diode (LED) and a method for fabricating the LED is disclosed. The LED includes a sidewall or surface that is inclined. A reflective film is formed on the inclined sidewall or surface to allow light to reflect from the reflective film and to emit the light upward or in a favorable direction with respect to the device, thereby being configured and enabled to improve a light output of the LED and dispense with an additional passivation process. Read more »

IP, Reports & Roadmaps | Jul 05, 2006

Semiconductor light emitting diode having textured structure and method of manufacturing the same

Cross sectional view of a semiconductor light emitting diode A semiconductor light emitting diode having a textured structure and a method of manufacturing the semiconductor light emitting diode are provided. The method includes forming a first semiconductor layer on a substrate; forming a textured structured first semiconductor layer by penetrating a material of a material layer into the first semiconductor layer after the material layer is formed on the first semiconductor layer and annealed; and forming a second semiconductor layer on the first semiconductor layer. Read more »

IP, Reports & Roadmaps | Jun 27, 2006

LED lighting system

Block diagram of a portion of an LED based lighting system Method and system are disclosed for compensating for color variations due to thermal differences in LED based lighting systems. The method and system involves characterizing the LEDs to determine what PWM (pulse-width modulation) is needed at various operating temperatures to achieve a desired resultant color. The characterization data is then stored in the microprocessor either in the form of a correction factor or as actual data. When an operating temperature that is different from a calibration temperature is detected, the characterization data is used to adjust the PWM of the LEDs to restore the LEDs to the desired resultant color. Read more »

IP, Reports & Roadmaps | Jun 22, 2006

Organic light emitting diode (oled) having improved stability, luminance, and efficiency

Simplified cross section view of an organic light emitting diode (OLED) An organic light emitting diode (OLED) includes a relatively thin diamnond-like carbon (DLC) layer disposed between the anode and the hole transport layer to improve luminous efficiency and operating life time. The relatively thin DLC layer inhibits hole injection, which balances charge flow and improves efficiency, and increases the surface smoothness of the anode, which contributes to the increased operating life time. Read more »

IP, Reports & Roadmaps | Jun 22, 2006

Thin gallium nitride light emitting diode device

Flow chart showing the process for manufacturing a unit chip of a thin GaN LED Disclosed is a light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded. Preforms for manufacturing the LED device and a method for manufacturing the LED device are also disclosed. The sapphire substrate, on which the crystal structure of the light emitting diode has grown, is processed into a unit chip before being removed. Thus, any crack in the crystal structure of the light emitting diode that may occur during the removal of the sapphire substrate can be prevented. Therefore, a thin light emitting diode device can be manufactured in a mass production system. Read more »

IP, Reports & Roadmaps | Jun 08, 2006

Programmable driving method for light emitting diode

Schematic view of an organic light emitting diode A programmable driving method for light emitting diode is disclosed, which is capable of providing a programmable multi-phase segment and a corresponding programmable multi-phase actuating signal to an LED with respect to user specification, such that an optimal driving sequence can be provided to the LED according to the requirements of the manufacturing process of a LED display and thus enabling the performance of the gray levels displayed by the LED display to be optimized. Read more »

IP, Reports & Roadmaps | Jun 08, 2006

Light emitting diode package having multiple molding resins

Sectional view illustrating a light emitting diode package Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented. Read more »

News-Spot | IP, Reports & Roadmaps | Mar 01, 2002

IST Obtains Further UK LED & OLED Driver Patent to Improve Efficiency and Reduce Ripple Current Through SSL Loads

Integrated System Technologies (IST) Ltd announced today the issuing by the UK Patent Office of its patent that covers power supply technologies for the rapidly expanding LED and OLED lighting sector. Read more »

IP, Reports & Roadmaps

Flip-chip light emitting diode with high light-emitting efficiency

Schematic drawing of a flip-chip type LED in accordance with the present invention. A flip-chip light emitting diode with high light-emitting efficiency is disclosed. The LED includes a transparent conductive layer, an oxide layer, a reflective metal layer, a conductive layer, and a protective diffusion layer sequentially disposed over a p-type semiconductor layer. Thereby, light emitting from a light-emitting layer toward the p-type semiconductor layer is reflected and penetrating a transparent substrate and emitting outwards. Thus the problem of light shielded from the flip-chip type LED is solved and the light-emitting efficiency is improved. Furthermore, the present invention disposes the LED chip in a face-down orientation on a conductive substrate by flip-chip technology so as to enhance heat-dissipation efficiency of the LED. Read more »

FEATURED

UniDriver® Universal Input Line Voltage LED Drivers

UniDriver® Universal Input Line Voltage LED Drivers LTF Technology’s UniDriver Series offers the ultimate in flexibility and ease of driver selection for lighting industry OEMs and specifiers. These technologically-advanced LED drivers offer True-Tri-Mode dimming from 100V to 277V (ELV, TRIAC, 0-10V), dimming levels from 100% to 0.1%, compatibility ... Read more »

FEATURED

NICHIA LED Technology Presented at LICHTWOCHE München

NICHIA LED Technology Presented at LICHTWOCHE München LED manufacturer NICHIA, a specialist in highly efficient lighting, Human Centric Lighting and the imitation of natural light, will participate in the Munich Lichtwoche 2021 from 5 to 12 November with a light installation, two presentations and a discussion on the topic of UV-C. The light ... Read more »

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