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IP, Reports & Roadmaps | Aug 30, 2007

ITC Denies Epistar`s Motion to Stay Exclusion Order in Investigation Initiated by Philips Lumileds

The United States International Trade Commission (ITC) has denied Epistar`s motion to stay the ITC`s Exclusion Order barring importation of Epistar`s OMA, MB and GB LEDs. After the ITC ruled that Epistar`s current AlInGaP LEDs infringe Philips Lumileds` patent rights and issued an exclusion order banning importation of those LEDs, Epistar filed motions before both the ITC and the U.S. Court of Appeals for the Federal Circuit to stay enforcement of the exclusion order. The ITC has denied Epistar`s motion. Read more »

IP, Reports & Roadmaps | Aug 20, 2007

Nitride based LED with a p-type injection region

Schematic drawing of a LED with a p-type injection region. An LED chip (2) is composed of a p-GaN layer (10), an n-GaN layer (14), and an MQW emission layer (12) that is sandwiched between the GaN layers (10 and 14). Each layer is made of a GaN semiconductor. Light exits the LED chip (2) through the n-GaN layer (14). A p-electrode (16) of the LED chip (2) has a surface profile (24B) defined by a plurality of columnar projections (24A) formed in a uniformly distributed relation on the surface facing toward the p-GaN layer (10). The p-electrode (16) is in contact with the p-GaN layer (10) at the top surface of each projection (24A). Read more »

IP, Reports & Roadmaps | Aug 20, 2007

Light emitting diode package

Schematic drawing of the improved LED package. Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum. Read more »

IP, Reports & Roadmaps | Aug 13, 2007

Flip-chip light emitting diode with high light-emitting efficiency

Schematic drawing of a flip-chip type LED in accordance with the present invention. A flip-chip light emitting diode with high light-emitting efficiency is disclosed. The LED includes a transparent conductive layer, an oxide layer, a reflective metal layer, a conductive layer, and a protective diffusion layer sequentially disposed over a p-type semiconductor layer. Thereby, light emitting from a light-emitting layer toward the p-type semiconductor layer is reflected and penetrating a transparent substrate and emitting outwards. Thus the problem of light shielded from the flip-chip type LED is solved and the light-emitting efficiency is improved. Furthermore, the present invention disposes the LED chip in a face-down orientation on a conductive substrate by flip-chip technology so as to enhance heat-dissipation efficiency of the LED. Read more »

IP, Reports & Roadmaps | Aug 13, 2007

Seoul Semiconductor Wins Patent Case in Taiwan

Seoul Semiconductor (KOSDAQ: 046890), one of the ten largest LED manufacturers in the world, announced today that a Taiwan Intellectual Property Office has ruled that the invalidation action brought by Advanced Optoelectronic Technology Inc.(AOT) against Seoul Semiconductor s white LED patent in Taiwan is not sustained. Read more »

IP, Reports & Roadmaps | Aug 06, 2007

Packages for semiconductor LEDs utilizing dispensed reflectors and methods of forming the same

Cross sectional view according to some embodiments of the invention. A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED includes forming a first meniscus control feature on a substrate and defining a first region of the substrate, forming a second meniscus control feature surrounding the first region and defining a second region of the substrate between the first meniscus control feature and the second meniscus control feature, mounting an LED chip within the first region, dispensing a first encapsulant material including a reflective material within the second region, curing the first encapsulant material, dispensing a second encapsulant material on the substrate within the first region, and curing the second encapsulant material. Read more »

IP, Reports & Roadmaps | Aug 03, 2007

Color sensor integrated light emitting diode for LED backlight

LED package integrated with color sensor according to the present invention. A color sensor integrated light emitting diode (LED) is packaged with LED and color sensor mounted side by side inside LED package comprising a heat sink for mounting LED and the color sensor, both the color sensor and LED being buried by a high refractive index polymer followed by a diffuser layer and light extraction layer, all of which are transparent. Posts electrically linked to LED and color sensor inside the package are provided for external connection to LED and color sensor. Plurality of color sensors and LEDs can be packaged inside a single package with proper orientation of desired color LEDs to receive desired color by color sensors. Color change at the very source of light emission can be controlled with color sensor integrated LED package more effectively than conventional methods. Plurality of these packages can be employed for LED backlight for LCD, consumer lighting, decorative lighting and signage displays. Read more »

IP, Reports & Roadmaps | Aug 01, 2007

Integrated led chip to emit multiple colors and method of manufacturing the same

Manufacturing process for the present invention. The present invention is a monolithic, multi-colored LED chip and a method for making the same. The LED chip is comprised of a substrate and a plurality of light emitting structures, each light emitting structure capable of emitting a wavelength of light unique compared to others and each structure layered on top of another structure and separated by a dielectric layer. The light emitting structures are then capable of independent or tandem activation, yielding the original colors of each section, blends of colors, and white light. The method starts with the base for such a chip and etches layers of the chip away, leaving exposed sections, to reach electrical contact layers for each light emitting structure. Electrically conductive material is then used to fill the exposed sections and is, in turn, etched away to leave contacts. An insulating material is then used to fill in the resultant areas. Read more »

IP, Reports & Roadmaps | Aug 01, 2007

Color LED driver

Configuration of a color LED driver according to the present invention. Disclosed herein is a color LED driver, which is capable of being implemented by a compact structure without a feedback structure and accompanying a small size and low cost, by directly connecting a negative temperature coefficient (NTC) thermistor to a driving current path of a color LED applied to an LCD backlight to compensate a characteristic variation of the LED due to a variation in a temperature. The color LED driver includes a driving constant voltage source 100 which supplies a predetermined driving constant voltage VD; a driving circuit 200 which converts the driving constant voltage VD of the driving constant voltage source 100 into a plurality of driving currents, for driving color LEDs, the plurality of driving currents including red LED driving current Ird, green LED driving current Igd and blue LED driving current Ibd; a temperature compensation unit 300 which compensates variations in the red LED driving current Ird and the green LED driving current Igd due to a variation in a temperature, among the plurality of driving currents from the driving circuit 200; and an LED unit 400 including a plurality of color LEDs which are turned on by the driving currents from the temperature compensation circuit 300 and the driving current from the driving circuit 200. Read more »

IP, Reports & Roadmaps | Jul 20, 2007

Nexxus Lighting Issued Two New LED Lighting Technology Patents

Nexxus Lighting, Inc. (NASDAQ Capital Market: NEXS) a world leader in advanced lighting technology, including solid-state LED and fiber optic lighting systems and controls used in commercial, architectural, signage, swimming pool and retail lighting today announced that it has been issued two new patents related to its LED lighting technology. Read more »

IP, Reports & Roadmaps | Jul 20, 2007

Settlement of Patent Litigation with OSRAM

Citizen Electronics Co., Ltd. with headquarters in Fujiyoshida-city, Yamanashi, Japan and President, Takashi Masuzawa (“CITIZEN ELECTRONICS”), a totally-held subsidiary of Citizen Holdings Co., Ltd. with headquarters in Nishi-Tokyo city, Tokyo, Japan and President Makoto Umehara, reached a settlement with Osram GmbH Munich, Germany and its subsidiary OSRAM Opto Semiconductors GmbH Regensburg, Germany (collectively “OSRAM”) over patent lawsuit and litigation cases that have been running since 2005, and concluded a settlement agreement on July 13, 2007. Read more »

IP, Reports & Roadmaps | Jul 13, 2007

Philips Lumileds Initiates Notification of Epistar Infringement and ITC Exclusion Order to Chip Packagers and Users of Epistar`s OMA, MB, and GB LED Products

Philips Lumileds is notifying chip packagers, distributors and others using Epistar`s OMA, MB and GB LEDs that the U.S. International Trade Commission (ITC) has issued an order excluding importation of these products into the United States because they infringe Philips Lumileds` patent rights. The exclusion order prohibits importation of Epistar`s infringing LEDs as well as packaged LEDs containing the infringing LEDs and boards primarily consisting of arrays of such packaged LEDs. The Presidential Review period has ended and the ITC`s Exclusion Order is now final and in full force. Read more »

IP, Reports & Roadmaps | Jul 09, 2007

LED drive circuit having temperature compensation

A LED driver circuit in accordance with the present invention. A LED driver circuit is provided for controlling the brightness of a LED. A control circuit is used for generating a LED current in accordance with a resistor. The control circuit is further coupled to detect a LED voltage for adjusting the LED current in reference to the LED voltage. The value of the LED voltage is correlated to the LED temperature. Therefore, the LED current is then programmed in accordance with the LED temperature. Read more »

IP, Reports & Roadmaps | Jun 14, 2007

Color Kinetics and High End Systems announce licensing agreement

Color Kinetics Incorporated (NASDAQ: CLRK) and High End Systems Inc., respective industry leaders in LED and entertainment lighting systems, today announced a global licensing agreement that reflects a continuing surge in the use of LED sources for stage and event lighting. High End Systems will license Color Kinetics' patent portfolio to develop its first line of products incorporating multicolor LEDs. The initial offering will uniquely combine conventional sources with LEDs for accent purposes. Read more »

IP, Reports & Roadmaps | May 11, 2007

LED Lighting Fixtures Receives First Patent

Morrisville, NC, May 11, 2007 - LED Lighting Fixtures, Inc. (LLF) today announced that the U.S. Patent Office has issued LLF’s first patent # 7,213,940. The ‘940 patent titled Lighting Device and Lighting Method, covers a unique approach for LEDs to create white light. The LED industry typically produces white light by either coating true blue LEDs with a YAG phosphor or combining red, green and blue LEDs. LLF uses a new and distinctive approach described in the ‘940 patent to deliver the high efficacy and excellent color quality found in all of LLF’s products. Read more »

IP, Reports & Roadmaps | Apr 18, 2007

Led with light transmissive heat sink

An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three. Read more »

IP, Reports & Roadmaps | Mar 16, 2007

Light Emitting Diode Package with Diffusor and method of manufacturing the same

LED package with diffusor according to the present invention. The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source. Read more »

IP, Reports & Roadmaps | Feb 28, 2007

ITC adopts initial determination of infringement by Epistar’s MB LEDs and agrees to consider whether OMA and GB LEDs infringe as well

San Jose, CA — Administrative Law Judge (“ALJ”) Sydney Harris’ recommendation last month for the exclusion of Epistar’s metal bond (“MB”) products will stand according to a new, favorable ruling issued by the United States International Trade Commission (“ITC”) this week in Philips Lumileds’ patent infringement case against Epistar. Read more »

IP, Reports & Roadmaps | Feb 15, 2007

Court decision has minimal impact: TIR to present strong evidence of invalidity and non-infringement

Vancouver, BC – TIR Systems Ltd. (TSX: TIR) - The United States District Court for the District of Massachusetts issued a decision that the evidence supporting inequitable conduct committed by Color Kinetics during prosecution of its patents before the United States Patent and Trademark Office was not sufficient to meet the high burden of proof required for this cause of action. Read more »

IP, Reports & Roadmaps | Feb 13, 2007

Light Emitting Diodes packaged for high temperature operation

Embodiment of the packaged LED and schematic cross section In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250°C. Read more »

IP, Reports & Roadmaps | Feb 05, 2007

Lighting Science Group announces licensing and production agreement with NuTech Lighting

Dallas, Texas USA-- Lighting Science Group Corporation, a leading provider of energy-efficient and environmentally responsible LED lighting solutions announced today that it signed a licensing and product supply agreement with NuTech Lighting, a leading privately held lighting manufacturer and distributor based in New York City. Read more »

IP, Reports & Roadmaps | Feb 02, 2007

Osram and Philips sign a license agreement for LED and OLED

Rengensburg, Germany... OSRAM and Philips have signed crosslicense agreement covering optoelectronic semiconductors. The agreement involves the mutual licensing of patents for all inorganic and organic LED. Read more »

IP, Reports & Roadmaps | Jan 29, 2007

U.S. international trade commission administrative law judge rejects Philips Lumileds’ request to prohibit importation into the U.S. of downstream products containing Epistar’s LED products

Hsinchu, Taiwan-- The Administrative Law Judge (“ALJ”) of the U.S. International Trade Commission (“USITC”) issued his Recommended Determination that sets forth the final order the ALJ believes should be issued by the USITC. In his Recommended Determination, the ALJ did not recommend that a cease and desist order be issued, and rejected Philips Lumileds’ request to extend a limited exclusion order to third-party finished products. Read more »

IP, Reports & Roadmaps | Jan 24, 2007

Administrative Law Judge recommends order excluding Epistar’s infringing LEDs and downstream products

San Jose, California USA - Administrative Law Judge Harris of the International Trade Commission ("ITC") recommended that Epistar's infringing LED chips, along with certain products incorporating those infringing chips, should be the subject of a limited exclusion order. Read more »

IP, Reports & Roadmaps | Jan 19, 2007

Color Kinetics and Lamina Ceramics Announce Licensing Agreement

Boston, MA and Westampton, NJ – Color Kinetics Incorporated (NASDAQ: CLRK) and Lamina Ceramics Inc. today announced the signing of a global licensing agreement. Lamina, a manufacturer of LED light engines, will have access to Color Kinetics’ complete patent portfolio to continue the development and sale of its products worldwide. Read more »

IP, Reports & Roadmaps | Jan 11, 2007

Philips Lumileds obtains favorable ruling in patent infringement litigation against Epistar

SAN JOSE, CALIFORNIA – Philips Lumileds announced today that it has received a favorable ruling from the Administrative Law Judge (“ALJ”) of the United States International Trade Commission (“ITC”) presiding over Philips Lumileds’ patent infringement litigation against Epistar Corporation. Read more »

IP, Reports & Roadmaps | Jan 11, 2007

Cermet announces license agreement with georgia Institute of Technology for white LED technology

Atlanta, Georgia USA--Cermet, Inc has negotiated an exclusive license agreement for white LED technology developed with the Georgia Institute of Technology. Read more »

IP, Reports & Roadmaps | Jan 11, 2007

Nichia's actions against a US maker of Lighting Appliances

Nichia Corporation announced that it has recently reached resolution of an intellectual property dispute with a maker of Lighting Appliances in the U.S. Nichia has been actively pursuing its patent enforcement strategy and has been demanding that those who have sold products infringing Nichia's U.S. patents stop selling such products. Read more »

IP, Reports & Roadmaps | Jan 02, 2007

Integrating chamber cone light using LED sources

Example of a radiant energy emitting system A system to provide radiant energy of selectable spectral characteristic (e.g. a selectable color combination) uses an integrating cavity to combine energy of different wavelengths from different sources. The cavity has a diffusely reflective interior surface and an aperture for allowing emission of combined radiant energy. Sources of radiant energy of different wavelengths, typically different-color LEDs, supply radiant energy into the interior of the integrating cavity. In the examples, the points of entry of the energy into the cavity typically are located so that they are not directly visible through the aperture. The cavity effectively integrates the energy of different wavelengths, so that the combined radiant energy emitted through the aperture includes the radiant energy of the various wavelengths. The apparatus also includes a control circuit coupled to the sources for establishing output intensity of radiant energy of each of the sources. Control of the intensity of emission of the sources sets the amount of each wavelength of energy in the combined output and thus determines a spectral characteristic of the radiant energy output through the aperture. Read more »

IP, Reports & Roadmaps | Dec 26, 2006

Diode Lighting System

Schematic side view of the lighting system A lighting system for stage, theatrical and architectural lighting, comprising a frame for supporting a plurality of light emitting diodes. The diodes are mounted to the frame so that each diode is both secured to the frame and also simultaneously positioned wherein each discrete diode light beam is directed to a prescribed remote focal point (target zone) and thereupon directed to a predetermined illumination area. Electrical power for transmitting and controlling electrical voltage to light emitting diodes by electrical circuitry integral with the frame. The frame can be configured as any hollow volume such a cone, a semi-ellipse, and a semi-sphere or can be configured as planar. Flexible blanks having apertures and pads for electrical connections can be used to construct rigid frames. An imaging gate a collimating lens and a focusing lens can be interposed between the frame and the illumination area. The frame can also be a sandwich frame having positive and negative electrically conductive layers interposed between layers of biasable insulating foam. Read more »

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