Intellectual Properties
IP, Reports & Roadmaps |
Apr 29, 2017
Method for manufacturing super bright light emitting diode of nanorod array having InGaN quantum well
An GaN light emitting diode (LED) having a nanorod (or, nanowire) structure is disclosed. The GaN LED employs GaN nanorods in which a n-type GaN nanorod, an InGaN quantum well and a p-type GaN nanorod are subsequently formed in a longitudinal direction by inserting the InGaN quantum well into a p-n junction interface of the p-n junction GaN nanorod. In addition, a plurality of such GaN nanorods are arranged in an array so as to provide an LED having much greater brightness and higher light emission efficiency than a conventional laminated-film GaN LED.
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News-Spot | Resources | Intellectual Properties | Licensing |
Apr 29, 2017
Lumitech Licenses Seoul Semiconductor for PI-LED Technology Applications
Seoul Semiconductor, a global leading LED components manufacturer from Korea, and the Austrian company Lumitech, a leading manufacturer of components for Human Centric Lighting announced a licensing agreement for PI-LED technology patents. These patents govern the industrial trade mark rights of Lumitech’s PI-LED technology, which can implement tunable white from 2.500 to 7.000K with perfect colour rendering in a high and constant efficiency. Based on the license agreement, Seoul Semiconductor has the right to offer tunable white components based on the leading PI-LED technology, worldwide.
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IP, Reports & Roadmaps |
Apr 29, 2017
Luminus Devices Collects Ten More Patents - Now has 21 Patents Issued, with 120 Applications Pending
Luminus Devices, Inc., the developer and manufacturer of PhlatLight® (Photonic Lattice) LEDs that are used in display and lighting applications, today announced it has received its 21st United States patent for its PhlatLight technology. This rapidly growing patent portfolio highlights Luminus Devices’ technology leadership in the LED industry. And with 120 additional patents pending in the United States and foreign countries, Luminus will continue its leadership in solid state lighting innovation.
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IP, Reports & Roadmaps |
Apr 29, 2017
Luminus Devices Awarded 50th U.S. Patent For ‘Big-Chip’ LEDs
Luminus Devices, developer and manufacturer of ‘big-chip’ PhlatLight® LEDs, today announced that the United States Patent and Trademark Office (USPTO) recently awarded the company its 50th patent. Having pioneered big-chip LED technology, Luminus has aggressively filed intellectual property (IP) for protection of big chip LED devices, packages and systems. In addition, the company has also been granted 13 non-U.S. issued patents in China, Korea and Taiwan that extend big-chip LED protection into those countries.
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IP, Reports & Roadmaps |
Apr 29, 2017
Luminus devices announces issuance of core patents covering photonic lattice technology
Woburn, Massachusetts, Luminus Devices, Inc. today announced that it has received six major U.S. patents for its PhlatLight™ (Photonic Lattice Light Source) technology.
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IP, Reports & Roadmaps |
Apr 29, 2017
Lighting Science Group Obtains Preliminary Injunction Order Against Philips
Lighting Science Group Corporation (OTC Bulletin Board: LSCG) (LSG), a developer and integrator of intelligent LED lighting solutions, today announced that on October 7, 2008, the Superior Court of California for Sacramento County issued a preliminary injunction against Philips Solid State Lighting Solutions, Inc., Koninklijke Philips Electronics N.V. and Philips Electronics North America Corporation (collectively "Philips") preventing Philips from using or relying on certain confidential or trade secret information obtained from LSG.
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IP, Reports & Roadmaps |
Apr 29, 2017
Lighting Science Group is granted eighth patent for advances in LED lighting technologies
DALLAS, Lighting Science Group Corporation (OTCBB:LSGP) announced today that the United States Patent and Trademark Office has granted the company its eighth patent for Optimized Digital Lighting(TM) (ODL(R)) technologies.
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IP, Reports & Roadmaps |
Apr 29, 2017
Lighting Science Group announces licensing and production agreement with NuTech Lighting
Dallas, Texas USA-- Lighting Science Group Corporation, a leading provider of energy-efficient and environmentally responsible LED lighting solutions announced today that it signed a licensing and product supply agreement with NuTech Lighting, a leading privately held lighting manufacturer and distributor based in New York City.
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IP, Reports & Roadmaps |
Apr 29, 2017
Lighting Science Group Announces Developments in Litigation with Philips Electronics
Lighting Science Group Corporation (OTC Bulletin Board: LSCG) (LSG), a developer and integrator of intelligent LED lighting solutions, today announced in conjunction with its annual shareholders' meeting, that there have been further developments in its on-going dispute with Philips Solid State Lighting Solutions, Inc., Koninklijke Philips Electronics N.V. and Philips Electronics North America Corporation (collectively "Philips").
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IP, Reports & Roadmaps |
Apr 29, 2017
Light emitting diodes packaged for high temperature operation
In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250.degree. C.
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IP, Reports & Roadmaps |
Apr 29, 2017
Light Emitting Diodes packaged for high temperature operation
In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250°C.
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IP, Reports & Roadmaps |
Apr 29, 2017
Light emitting diode package with protective function against electrostatic discharge
The present invention provides an LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The invention includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
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IP, Reports & Roadmaps |
Apr 29, 2017
Light Emitting Diode Package with Diffusor and method of manufacturing the same
The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
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IP, Reports & Roadmaps |
Apr 29, 2017
Light emitting diode package having multiple molding resins
Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
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IP, Reports & Roadmaps |
Apr 29, 2017
Light emitting diode package
Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum.
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IP, Reports & Roadmaps |
Apr 29, 2017
Light Emitting Diode Light Source with Heat Transfer Means
High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common electrode for the LEDs mounted on the heat pipe. Multiple heat pipes can be arranged so that the LED arrays form a light recycling cavity to emit and reflect light.
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IP, Reports & Roadmaps |
Apr 29, 2017
Ledzworld Signs Patent License Agreement with Cree
Cree, Inc. announced on Monday December 19 that it has granted five innovative LED lighting manufacturers licenses to select Cree patents through its recently launched remote phosphor licensing program. By making fundamental remote phosphor patents available through license, Cree is further enabling LED lighting adoption, as Cree innovations facilitate the development of LED lights combining remote phosphor optical elements with blue LEDs.
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IP, Reports & Roadmaps |
Apr 29, 2017
Led with light transmissive heat sink
An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.
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IP, Reports & Roadmaps |
Apr 29, 2017
Led package structure and method for manufacturing the same
A LED package structure is disclosed. The LED package structure includes a substrate, a light emitting diode, a plasma chemical vapor deposition layer and a transparent material layer, wherein the substrate has a plurality of contacts. The light emitting diode is disposed on the substrate and electrically contacted to the contacts. The plasma chemical vapor deposition layer is disposed on the light emitting diode and the refractive index of the plasma chemical vapor deposition layer is smaller than that of the light emitting diode. The transparent material layer is disposed on the plasma chemical vapor deposition layer and the refractive index of the transparent material layer is smaller than that of the plasma chemical vapor deposition layer.
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IP, Reports & Roadmaps |
Apr 29, 2017
Led luminaire and arrangement comprising a luminaire body and an led operating device
The invention discloses an LED luminaire, in the case of which an LED module is applied to the luminaire body such that the height of the luminaire body and the LED module is ≦8 mm and the luminaire body at least partially forms the heat sink for the LED module. In this case, LED modules having power ratings of ≧3 watts are used. LED operating devices can be used for voltage supply purposes which form an outer face section of an arrangement comprising a luminaire body and an LED operating device, the total height of the luminaire body and LED operating device being ≦10 mm, and the LED operating device preferably being cooled via the luminaire body.
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IP, Reports & Roadmaps |
Apr 29, 2017
LED lighting system
Method and system are disclosed for compensating for color variations due to thermal differences in LED based lighting systems. The method and system involves characterizing the LEDs to determine what PWM (pulse-width modulation) is needed at various operating temperatures to achieve a desired resultant color. The characterization data is then stored in the microprocessor either in the form of a correction factor or as actual data. When an operating temperature that is different from a calibration temperature is detected, the characterization data is used to adjust the PWM of the LEDs to restore the LEDs to the desired resultant color.
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IP, Reports & Roadmaps |
Apr 29, 2017
LED Lighting Fixtures Receives First Patent
Morrisville, NC, May 11, 2007 - LED Lighting Fixtures, Inc. (LLF) today announced that the U.S. Patent Office has issued LLF’s first patent # 7,213,940. The ‘940 patent titled Lighting Device and Lighting Method, covers a unique approach for LEDs to create white light. The LED industry typically produces white light by either coating true blue LEDs with a YAG phosphor or combining red, green and blue LEDs. LLF uses a new and distinctive approach described in the ‘940 patent to deliver the high efficacy and excellent color quality found in all of LLF’s products.
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IP, Reports & Roadmaps |
Apr 29, 2017
LED driver
A light emitting diode (LED) driver to drive an LED, including a current adjusting unit to adjust magnitude of a current flowing on the LED by supplying power from a power supply device to the LED and cutting off the power. A modulation control unit is provided to modulate a waveform of the current flowing on the LED by controlling the adjustment operation of the current adjusting unit. A constant current offset unit to control the adjustment operation of the current adjusting unit is provided so that the current flowing on the LED is higher or equal to a predetermined value as the waveform thereof is modulated. Thus, provided is an LED driver having improved power consumption efficiency.
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IP, Reports & Roadmaps |
Apr 29, 2017
LED drive circuit having temperature compensation
A LED driver circuit is provided for controlling the brightness of a LED. A control circuit is used for generating a LED current in accordance with a resistor. The control circuit is further coupled to detect a LED voltage for adjusting the LED current in reference to the LED voltage. The value of the LED voltage is correlated to the LED temperature. Therefore, the LED current is then programmed in accordance with the LED temperature.
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IP, Reports & Roadmaps |
Apr 29, 2017
Kyma Acquires Select Assets and IP Rights from Fox Group
Kyma Technologies, Inc., a leading supplier of ultra-high purity crystalline gallium nitride (GaN) and aluminum nitride (AlN) materials and related products and services, is pleased to announce that Kyma has acquired from The Fox Group certain assets and intellectual property rights.
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IP, Reports & Roadmaps |
Apr 29, 2017
Korean Court Finds Seoul Semiconductor Liable for Defamation
Nichia Corporation announced today that the Seoul Central District Court rendered a decision that Seoul Semiconductor Co., Ltd. is liable for defamation, and ordered Seoul Semiconductor to pay Nichia a damages amount of KRW 10,000,000, as well as take appropriate corrective measures to restore Nichia’s reputation.
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IP, Reports & Roadmaps |
Apr 29, 2017
Judge Chesney Denies Fees for "Side View LED Design Patent Infringement" to Nichia
In the side view LED design patent infringement litigation between Seoul Semiconductor Co. Ltd. (“Seoul”) and Nichia Corporation (“Nichia”), Judge Chesney of the U.S. District Court for the Northern District of California issued an "Order Denying Plaintiff's [Nichia's] Motion for Finding of Exceptional Case and Award Attorney's Fees." By the motion, Nichia sought approximately $2.5 million in fees against Seoul. In her order, Judge Chesney ruled that it "would not be appropriate" to award fees to Nichia and that the case was not exceptional.
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IP, Reports & Roadmaps |
Apr 29, 2017
ITC Investigation on Products Suspected to Infringe Professor Neumark's LED/LD Patent
The U.S. International Trade Commission (ITC) has voted to institute an investigation of certain short-wavelength light emitting diodes, laser diodes, and products containing same. The products at issue in this investigation are short-wavelength (e.g., blue, violet) LEDs and laser diodes that are used in products such as hand-held mobile devices, instrument panels, billboards, traffic lights, HD DVD players (e.g., Blu-ray disc players), and data storage devices. 30 companies are affected by the investigation.
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