Engineering, Production & Testing
Products, Materials + Tools
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Dec 14, 2011
Mentor Graphics Announces Industry’s First Integrated Solution for Component-to-System Thermal Characterization and Analysis
News-Spot | Products, Materials + Tools
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Dec 14, 2011
NGK Introduces New Wafer Products for Electronic Devices at SEMICON Japan
NGK Insulators, Ltd. (President: Taro Kato; Headquarters: Nagoya, Japan) has developed new wafer products for electronic device applications, such as ultra high brightness (UHB) LEDs and smartphones. The Company will exhibit samples of these wafers for the first time at SEMICON Japan 2011, which will be held December 7 through 9 at Makuhari Messe in Chiba, Japan.
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Products, Materials + Tools
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Jan 24, 2012
AvaSpec-RS Series - the World’s Most Configurable Microspectrometer
Products, Materials + Tools
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Jan 24, 2012
Soitec and Sumitomo Electric Announce Major Milestone in Strategic Joint Development of Engineered GaN Substrates
Products, Materials + Tools
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Jan 25, 2012
Gamma Scientific Introduces New Spectrometer for Quick and Easy LED Testing
Products, Materials + Tools
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Jan 25, 2012
Instrument Systems Announces New Products for 2012
Products, Materials + Tools
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Feb 15, 2012
GPD Global’s PCD4H Dispense Pump Improves Yields for LED Manufacturers
Products, Materials + Tools
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Mar 07, 2012
Plansee's Newly Developed Mo-Cu R670 Prevents Cracks in LED Semiconductor Layers
Products, Materials + Tools
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Dec 31, 1969
opsira Introduces robo-goniometer for Flexible Measurement Tasks
Products, Materials + Tools
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Mar 14, 2012
Kulicke & Soffa Launches Dedicated Solution for LED Packaging Markets
Kulicke & Soffa Industries, Inc. today announced the formal launch of the LUMOS™ Capillary, a dedicated bonding solution for LED packaging markets.
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Products, Materials + Tools
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Mar 20, 2012
Ideal Measuring System for Mid-Sized SSL Luminaires and LED Modules
Products, Materials + Tools
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Apr 11, 2012
Labsphere Launches illumia® Line for Light Measurement
Products, Materials + Tools
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Apr 13, 2012
Essemtec Presents Innovations at SMT Nuremberg 2012
News-Spot | Products, Materials + Tools
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Apr 23, 2012
KLA-Tencor Announces New CIRCL™ Suite
Today KLA-Tencor Corporation announced a new, high-throughput defect inspection / metrology / review system for leading-edge chip manufacturers: the CIRCLTM suite. Designed for operation in lithography, outgoing quality control (OQC) and other process modules, this new cluster tool monitors the front side, back side and edge of the wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity and macro overlay error. Data collection is governed by DirectedSamplingTM, an innovative approach that uses results from one measurement to trigger other types of measurements within the cluster as needed.
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Products, Materials + Tools
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May 25, 2012
Kyma Demonstrates 10-Inch Diameter Aluminum Nitride on Sapphire Template Product
Products, Materials + Tools
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Jun 15, 2012
VEECO Introduced Three New Models MOCVD
Products, Materials + Tools
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Jun 21, 2012
PRUF LED Flips Switch on State-of-the-Art, Fully Automated Manufacturing Line
Products, Materials + Tools
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Jul 18, 2012
Labsphere illumia®lite a World First in Portable Spectral Flux Analysis
Products, Materials + Tools
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Jul 24, 2012
AIXTRON Introduces AIX G5+: 5x200 mm GaN-on-Si Technology for the AIX G5 Reactor Platform
Products, Materials + Tools
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Aug 03, 2012