Resources | LpR Article | Research | Thermal Management | Jan 15, 2018

Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL

Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL Besides general lighting, LEDs are penetrating many areas. At the same time, Internet of Things (IoT) has been rapidly evolving. Added electronics are expected to add an additional 70% to overall heat generation. Therefore, solving thermal problems will become more important again; on a par with footprint area and cost. Prof. Mehmet Arik, Director of EVATEG Center for Energy Efficient Electronics and Lighting Technologies at the Ozyegin University, and Umut Zeynep Uras, master student at the Ozyegin University, present some of the current, local, hotspot thermal issues caused by tight packaging. The severity of the problem for future lighting systems with added IoT will also be discussed. Finally, possible technologies to meet those challenges will be shown. Read more »

Resources | LpR Article | Technologies | Thermal Management | Jun 15, 2017

Looking for the Best Thermal Solution for CSP Module Designs

Looking for the Best Thermal Solution for CSP Module Designs Chip Scale Package (CSP) LED technology is not new but while it has been used for a while in TV backlighting applications, it is relatively new to lighting applications. In many respect CSPs are a new world for lighting module manufacturers as they are smaller, usually don’t have any ESD protection, have different light distribution, and, last but not least, have a smaller heat dissipation area. The latter asks for re-thinking the traditional thermal design for modules. Dr. Giles Humpston, Applications Engineer at Cambridge Nanotherm, explains in detail why CSP LEDs present a significant thermal challenge for module designers and outlines some fundamentals in calculating the thermal flow required to keep CSP LEDs cool. Read more »

Resources | White Papers | Thermal Management | Engineering | Simulation Tools | May 25, 2017

Smartcells - Enabling Fast and Accurate Electronics Thermal Design

Smartcells - Enabling Fast and Accurate Electronics Thermal Design This white paper introduces the concept of SmartCells™ in the context of Computational Fluid Dynamics (CFD) simulation software. They exist in FloTHERM XT™, a CAD enabled electronics cooling simulation tool supplied by Mentor Graphics (Ref 1). This document will explain what they are, how they differ from other meshing approaches employed in the CFD industry, and their benefits to CFD users and electronics thermal designers. Read more »

Resources | Technologies | Light Generation | Thermal Management | Medical | Feb 22, 2017

Thermal Management of an LED Light Source for Microscopes

Thermal Management of an LED Light Source for Microscopes Thermal management is a challenge for every LED and LASER solution. Microscope lighting solutions have some very critical requirements, especially if they concern medical applications. ESCATEC in Heerbrugg, Switzerland has a lot of experience in that field and covers all relevant technical disciplines. Wolfgang Plank, head of the MOEMS Future Laboratory and cleanroom, and Gerd Harder, Key Account Manager, give insights on the design process, thermal simulation and production of an LED light source for Leica Microsystems’ Ophthalmic Microscope Proveo 8. Read more »

Technologies | Thermal Management | Jul 14, 2016

Engineered “Sand” May Help Cool Electronic Devices and LEDs

Engineered “Sand” May Help Cool Electronic Devices and LEDs Giorgia Tech Research reports that Baratunde Cola, associated professor at the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology, would like to put sand into your computer and other electronic devices. Not beach sand, but silicon dioxide nanoparticles coated with a high dielectric constant polymer to inexpensively provide improved cooling for increasingly power-hungry electronic devices. Read more »

Technologies | Thermal Management | Jun 24, 2015

Litecool Turns LED Packaging on Its Side

Litecool's new packaging concept significantly reduces the thermal resistance of LED packages by using a vertical dielectric Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode. Read more »

Resources | White Papers | Thermal Management

WHITE PAPER: "High Intensity UV LED Sources Enabled by Next Generation Substrates"

SEM images of Nanotherm dielectric compared with anodic layers on Al substrate Thermal management of high-power UV LEDs is substantially more demanding than for white LEDs. This arises due to their lower efficacy combined with the end use requirement for intense light sources. Critical to the thermal management of densely packed LED arrays is the substrate the semiconductors are mounted on. This whitepaper investigates how next generation Nanoceramic substrates can benefit the LED industry and presents a case study of a 75W UV LED module, just 2cm². Read more »

Technologies | Thermal Management | Jul 30, 2013

NRL Researchers Discover Novel Material for Cooling of Electronic Devices

Schematic of thermal management in electronics: Local temperature increases occur as a result of current flow in active regions of devices and can lead to degradation of device performance. Materials with high thermal conductivities are used in heat spreading and sinking to conduct heat from the hot regions. (Photo: U.S. Naval Research Laboratory)  A team of theoretical physicists at the U.S. Naval Research Laboratory (NRL) and Boston College has identified cubic boron arsenide as a material with an extraordinarily high thermal conductivity and the potential to transfer heat more effectively from electronic devices than diamond, the best-known thermal conductor to date. Read more »

Resources | Intellectual Properties | Thermal Management | Feb 05, 2013

MP Lighting Got Patent for Active Cooling System for LED Lighting Granted

Depending on the placement of the NTC thermistor array in the general structure of LED fixture there are at least three versions possible MP Lighting, a designer and manufacturer of innovative LED fixtures, announced today it has been completed the Patent portfolio relating to its Active Cooling System (ACS) for LED lighting industry. Read more »

FEATURED

MOSO High Reliable & Flexible Programmable Outdoor LED Driver

MOSO High Reliable & Flexible Programmable Outdoor LED Driver MOSO, one of the most influential and well-known new energy enterprises in China, dedicates to provide the efficient, intelligent and safe outdoor LED power supply solutions by introducing its programmable LDP series worldwide. Read more »

FEATURED

Cree Launches Industry’s First Extreme Density LED

Cree Launches Industry’s First Extreme Density LED Cree announces the new XLamp® XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5½ times higher lumen density than Cree’s previous generation of high power LEDs. The XD16 LED combines breakthrough lumen density, low optical cross-talk, unsurpassed thermal contact and ease of ... Read more »

FEATURED

Lumileds Delivers up to 48% Higher “Punch” than Competitors

Lumileds Delivers up to 48% Higher “Punch” than Competitors Lumileds introduced today the Luxeon CZ Color Line, a product line optimized to deliver maximum punch. “The Luxeon CZ features up to 48% higher punch than any other undomed color LED,” said Jennifer Holland, Product Line Director of the Luxeon Color Family. To meet the recent market trend of color ... Read more »

FEATURED

LIFUD High Bay LED Driver & Smart Sensor

LIFUD High Bay LED Driver & Smart Sensor LIFUD just launched her second generation of high bay driver, LF-FHB series. It can be completely turned OFF even without cutting off the AC power. When the second generation of LF-FHB series works with a smart sensor (= microwave sensor + light sensor) which was developed by LIFUD R&D, the light ... Read more »

EDITORIAL

High Conductive Foils Enabling Large Area Lighting

High Conductive Foils Enabling Large Area Lighting Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as one of the leading partners for research and development for surface technologies and organic electronics and Sefar AG, a leading manufacturer of precision fabrics from monofilaments, developed a roll-to-roll ... Read more »

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