Thermal Simulation Tool for LED Design Requirements
Light-emitting diodes (LEDs) are used and accepted in many areas of lighting technology today.
But without the right thermal design, LED lamps would not be viable. Chris Aldham, Development
Manager at 6SigmaET explains why keeping key components within narrow temperature limits is often
critical, why this makes thermal simulation important to LED device designers, and how to select the
right thermal management simulation tool for this task.
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Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL
Besides general lighting, LEDs are penetrating many areas. At the same time, Internet of Things (IoT)
has been rapidly evolving. Added electronics are expected to add an additional 70% to overall heat
generation. Therefore, solving thermal problems will become more important again; on a par with
footprint area and cost. Prof. Mehmet Arik, Director of EVATEG Center for Energy Efficient Electronics
and Lighting Technologies at the Ozyegin University, and Umut Zeynep Uras, master student at the
Ozyegin University, present some of the current, local, hotspot thermal issues caused by tight
packaging. The severity of the problem for future lighting systems with added IoT will also be discussed.
Finally, possible technologies to meet those challenges will be shown.
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Looking for the Best Thermal Solution for CSP Module Designs
Chip Scale Package (CSP) LED technology is not new but while it has been used for a while in TV
backlighting applications, it is relatively new to lighting applications. In many respect CSPs are a new
world for lighting module manufacturers as they are smaller, usually don’t have any ESD protection,
have different light distribution, and, last but not least, have a smaller heat dissipation area. The latter
asks for re-thinking the traditional thermal design for modules. Dr. Giles Humpston, Applications
Engineer at Cambridge Nanotherm, explains in detail why CSP LEDs present a significant thermal
challenge for module designers and outlines some fundamentals in calculating the thermal flow required
to keep CSP LEDs cool.
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Smartcells - Enabling Fast and Accurate Electronics Thermal Design
This white paper introduces the concept of SmartCells™ in the context of Computational Fluid Dynamics (CFD) simulation software. They exist in FloTHERM XT™, a CAD enabled electronics cooling simulation tool supplied by Mentor Graphics (Ref 1). This document will explain what they are, how they differ from other meshing approaches employed in the CFD industry, and their benefits to CFD users and electronics thermal designers.
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Thermal Management of an LED Light Source for Microscopes
Thermal management is a challenge for every LED and LASER solution. Microscope lighting solutions
have some very critical requirements, especially if they concern medical applications. ESCATEC in
Heerbrugg, Switzerland has a lot of experience in that field and covers all relevant technical disciplines.
Wolfgang Plank, head of the MOEMS Future Laboratory and cleanroom, and Gerd Harder, Key Account
Manager, give insights on the design process, thermal simulation and production of an LED light source
for Leica Microsystems’ Ophthalmic Microscope Proveo 8.
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Engineered “Sand” May Help Cool Electronic Devices and LEDs
Giorgia Tech Research reports that Baratunde Cola, associated professor at the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology, would like to put sand into your computer and other electronic devices. Not beach sand, but silicon dioxide nanoparticles coated with a high dielectric constant polymer to inexpensively provide improved cooling for increasingly power-hungry electronic devices.
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Litecool Turns LED Packaging on Its Side
Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode.
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WHITE PAPER: "High Intensity UV LED Sources Enabled by Next Generation Substrates"
Thermal management of high-power UV LEDs is substantially more demanding than for white LEDs. This arises due to their lower efficacy combined with the end use requirement for intense light sources. Critical to the thermal management of densely packed LED arrays is the substrate the semiconductors are mounted on. This whitepaper investigates how next generation Nanoceramic substrates can benefit the LED industry and presents a case study of a 75W UV LED module, just 2cm².
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NRL Researchers Discover Novel Material for Cooling of Electronic Devices
A team of theoretical physicists at the U.S. Naval Research Laboratory (NRL) and Boston College has identified cubic boron arsenide as a material with an extraordinarily high thermal conductivity and the potential to transfer heat more effectively from electronic devices than diamond, the best-known thermal conductor to date.
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MP Lighting Got Patent for Active Cooling System for LED Lighting Granted
MP Lighting, a designer and manufacturer of innovative LED fixtures, announced today it has been completed the Patent portfolio relating to its Active Cooling System (ACS) for LED lighting industry.
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