Resources | LpR Article | Research | Thermal Management | Testing | Oct 08, 2018

Automatic Panel Level Transient Thermal Tester

Automatic Panel Level Transient Thermal Tester LpR 67 Article, page 44:The thermal resistance junction in case is an important parameter for the reliability of LEDs because degradation of the LED is temperature driven. Simulation and testing has advanced over the past few years but transient thermal analysis (TTA), which is required to understand the thermal transfer path, is especially work and time consuming - and not automated. Gordon Elger, Professor for Electronic Manufacturing Technologies, Technische Hochschule Ingolstadt, and his co-authors, Maximilian Schmidt, Alexander Hans, and Dominik Müller, present and discuss an automatic panel level TTA tester. They explain the challenges and the solution and demonstrate the applicability of using LED test board-panels. Read more »

Technologies | Research News | Thermal Management | Jul 09, 2018

Intended for High-Performance Computer Chips - Maybe Also Useful for LEDs

Intended for High-Performance Computer Chips - Maybe Also Useful for LEDs The inner workings of high-power electronic devices must remain cool to operate reliably. High internal temperatures can make programs run slower, freeze or shut down. Researchers at the University of Illinois at Urbana-Champaign and The University of Texas, Dallas have collaborated to optimize the crystal-growing process of boron arsenide – a material that has excellent thermal properties and can effectively dissipate the heat generated in electronic devices. Read more »

Resources | Lp Article | Engineering | Thermal Management | May 15, 2018

Thermal Simulation Tool for LED Design Requirements

Thermal Simulation Tool for LED Design Requirements Light-emitting diodes (LEDs) are used and accepted in many areas of lighting technology today. But without the right thermal design, LED lamps would not be viable. Chris Aldham, Development Manager at 6SigmaET explains why keeping key components within narrow temperature limits is often critical, why this makes thermal simulation important to LED device designers, and how to select the right thermal management simulation tool for this task. Read more »

Resources | LpR Article | Research | Thermal Management | Jan 15, 2018

Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL

Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL Besides general lighting, LEDs are penetrating many areas. At the same time, Internet of Things (IoT) has been rapidly evolving. Added electronics are expected to add an additional 70% to overall heat generation. Therefore, solving thermal problems will become more important again; on a par with footprint area and cost. Prof. Mehmet Arik, Director of EVATEG Center for Energy Efficient Electronics and Lighting Technologies at the Ozyegin University, and Umut Zeynep Uras, master student at the Ozyegin University, present some of the current, local, hotspot thermal issues caused by tight packaging. The severity of the problem for future lighting systems with added IoT will also be discussed. Finally, possible technologies to meet those challenges will be shown. Read more »

Resources | LpR Article | Technologies | Thermal Management | Jun 15, 2017

Looking for the Best Thermal Solution for CSP Module Designs

Looking for the Best Thermal Solution for CSP Module Designs Chip Scale Package (CSP) LED technology is not new but while it has been used for a while in TV backlighting applications, it is relatively new to lighting applications. In many respect CSPs are a new world for lighting module manufacturers as they are smaller, usually don’t have any ESD protection, have different light distribution, and, last but not least, have a smaller heat dissipation area. The latter asks for re-thinking the traditional thermal design for modules. Dr. Giles Humpston, Applications Engineer at Cambridge Nanotherm, explains in detail why CSP LEDs present a significant thermal challenge for module designers and outlines some fundamentals in calculating the thermal flow required to keep CSP LEDs cool. Read more »

Resources | White Papers | Thermal Management | Engineering | Simulation Tools | May 25, 2017

Smartcells - Enabling Fast and Accurate Electronics Thermal Design

Smartcells - Enabling Fast and Accurate Electronics Thermal Design This white paper introduces the concept of SmartCells™ in the context of Computational Fluid Dynamics (CFD) simulation software. They exist in FloTHERM XT™, a CAD enabled electronics cooling simulation tool supplied by Mentor Graphics (Ref 1). This document will explain what they are, how they differ from other meshing approaches employed in the CFD industry, and their benefits to CFD users and electronics thermal designers. Read more »

Resources | Technologies | Light Generation | Thermal Management | Medical | Feb 22, 2017

Thermal Management of an LED Light Source for Microscopes

Thermal Management of an LED Light Source for Microscopes Thermal management is a challenge for every LED and LASER solution. Microscope lighting solutions have some very critical requirements, especially if they concern medical applications. ESCATEC in Heerbrugg, Switzerland has a lot of experience in that field and covers all relevant technical disciplines. Wolfgang Plank, head of the MOEMS Future Laboratory and cleanroom, and Gerd Harder, Key Account Manager, give insights on the design process, thermal simulation and production of an LED light source for Leica Microsystems’ Ophthalmic Microscope Proveo 8. Read more »

Technologies | Thermal Management | Jul 14, 2016

Engineered “Sand” May Help Cool Electronic Devices and LEDs

Engineered “Sand” May Help Cool Electronic Devices and LEDs Giorgia Tech Research reports that Baratunde Cola, associated professor at the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology, would like to put sand into your computer and other electronic devices. Not beach sand, but silicon dioxide nanoparticles coated with a high dielectric constant polymer to inexpensively provide improved cooling for increasingly power-hungry electronic devices. Read more »

Technologies | Thermal Management | Jun 24, 2015

Litecool Turns LED Packaging on Its Side

Litecool's new packaging concept significantly reduces the thermal resistance of LED packages by using a vertical dielectric Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode. Read more »

Resources | White Papers | Thermal Management

WHITE PAPER: "High Intensity UV LED Sources Enabled by Next Generation Substrates"

SEM images of Nanotherm dielectric compared with anodic layers on Al substrate Thermal management of high-power UV LEDs is substantially more demanding than for white LEDs. This arises due to their lower efficacy combined with the end use requirement for intense light sources. Critical to the thermal management of densely packed LED arrays is the substrate the semiconductors are mounted on. This whitepaper investigates how next generation Nanoceramic substrates can benefit the LED industry and presents a case study of a 75W UV LED module, just 2cm². Read more »

Technologies | Thermal Management | Jul 30, 2013

NRL Researchers Discover Novel Material for Cooling of Electronic Devices

Schematic of thermal management in electronics: Local temperature increases occur as a result of current flow in active regions of devices and can lead to degradation of device performance. Materials with high thermal conductivities are used in heat spreading and sinking to conduct heat from the hot regions. (Photo: U.S. Naval Research Laboratory)  A team of theoretical physicists at the U.S. Naval Research Laboratory (NRL) and Boston College has identified cubic boron arsenide as a material with an extraordinarily high thermal conductivity and the potential to transfer heat more effectively from electronic devices than diamond, the best-known thermal conductor to date. Read more »

Resources | Intellectual Properties | Thermal Management | Feb 05, 2013

MP Lighting Got Patent for Active Cooling System for LED Lighting Granted

Depending on the placement of the NTC thermistor array in the general structure of LED fixture there are at least three versions possible MP Lighting, a designer and manufacturer of innovative LED fixtures, announced today it has been completed the Patent portfolio relating to its Active Cooling System (ACS) for LED lighting industry. Read more »

FEATURED

Luxeon V2, the Best Choice for a 2 mm² High Power LED

Luxeon V2, the Best Choice for a 2 mm² High Power LED Lumileds announced breakthrough high power performance with the new Luxeon V2 LED. With the highest performance in its class for output and efficacy, the emitter easily enables DLC Premium performance at the system level. Luxeon V2 utilizes a 2 x 2 mm Chip Scale Package (CSP) in a 3.5 x 3.5 mm ... Read more »

FEATURED

The 22nd China (Guzhen) International Lighting Fair

The 22nd China (Guzhen) International Lighting Fair China (Guzhen) International Lighting Fair is based in China Lighting Capital- Guzhen Town, where thousands of lighting manufacturers lies and is dubbed as the source of lightings. With the help of local government and UBM, the fair has been successfully held for 21 editions. Read more »

FEATURED

Edison Opto Introduces Breakthrough AC Module Series

Edison Opto Introduces Breakthrough AC Module Series Edison Opto Corporation, the leading LED lighting company based in Taiwan, introduces a wide range of AC modules. These AC modules can be broadly used in ceiling lights, mirror front lights, corridor lights, tri-proof lights, and down lights to meet different customers’ requirements. Read more »

EDITORIAL

High Conductive Foils Enabling Large Area Lighting

High Conductive Foils Enabling Large Area Lighting Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as one of the leading partners for research and development for surface technologies and organic electronics and Sefar AG, a leading manufacturer of precision fabrics from monofilaments, developed a roll-to-roll ... Read more »

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